CONN IC DIP SOCKET 50POS GOLD
| Part | Mounting Type | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Current Rating (Amps) | Type | Type | Type | Contact Material - Mating | Pitch - Mating | Pitch - Mating | Housing Material | Contact Finish - Post | Termination | Termination Post Length [x] | Termination Post Length [x] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Pitch - Post | Pitch - Post | Contact Material - Post | Features | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Operating Temperature [Min] | Operating Temperature [Max] | Material Flammability Rating | Termination Post Length | Termination Post Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 50-9503-21 | Through Hole | 10 çin | 0.25 çm | 3 A | 22.86 mm | DIP | 0.9 in | Beryllium Copper | 0.1 in | 2.54 mm | Glass Filled, Nylon 4/6, Polyamide (PA46) | Gold | Wire Wrap | 0.36 in | 9.14 mm | 10 çin | 0.25 çm | Gold | 2.54 mm | 0.1 in | Phosphor Bronze | Closed Frame | 25 | 2 | 50 | -55 °C | 125 °C | UL94 V-0 | ||
Aries Electronics 50-9503-31 | Through Hole | 10 çin | 0.25 çm | 3 A | 22.86 mm | DIP | 0.9 in | Beryllium Copper | 0.1 in | 2.54 mm | Glass Filled, Nylon 4/6, Polyamide (PA46) | Gold | Wire Wrap | 10 çin | 0.25 çm | Gold | 2.54 mm | 0.1 in | Phosphor Bronze | Closed Frame | 25 | 2 | 50 | -55 °C | 125 °C | UL94 V-0 | 0.5 in | 12.7 mm | ||
Aries Electronics 50-9503-30 | Through Hole | 10 çin | 0.25 çm | 3 A | 22.86 mm | DIP | 0.9 in | Beryllium Copper | 0.1 in | 2.54 mm | Glass Filled, Nylon 4/6, Polyamide (PA46) | Tin | Wire Wrap | 200 µin | 5.08 µm | Gold | 2.54 mm | 0.1 in | Phosphor Bronze | Closed Frame | 25 | 2 | 50 | -55 °C | 105 ░C | UL94 V-0 | 0.5 in | 12.7 mm |