ESD-123 Series

Catalog

CONN SOCKET 46POS 0.1 GOLD PCB

Part	Insulation Color	Row Spacing - Mating	Number of Positions	Contact Finish - Mating	Termination	Fastening Type	Mounting Type	Contact Type	Pitch - Mating	Contact Length - Post	Insulation Height	Operating Temperature (Max)	Operating Temperature (Min)	Style	Material Flammability Rating	Number of Positions Loaded	Contact Finish Thickness - Mating	Number of Rows	Connector Type	Contact Finish - Post	Contact Shape	Insulation Material	Contact Material	Contact Finish Thickness - Post
Samtec Inc. ESD-123-T-23	Black	0.1 in	46	Gold	Solder	Push-Pull	Through Hole	Female Socket	0.1 in	0.115 in	0.3 in	125 °C	-55 °C	Board	UL94 V-0	All	10 µin	2	Elevated Socket	Tin	Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper
Samtec Inc. ESD-123-G-28	Black	0.1 in	46	Gold	Solder	Push-Pull	Through Hole	Female Socket	0.1 in	0.365 in	0.3 in	125 °C	-55 °C	Board	UL94 V-0	All	10 µin	2	Elevated Socket	Gold	Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper	10 µin
Samtec Inc. ESD-123-G-25	Black	0.1 in	46	Gold	Solder	Push-Pull	Through Hole	Female Socket	0.1 in	0.165 in	0.5 in	125 °C	-55 °C	Board	UL94 V-0	All	10 µin	2	Elevated Socket	Gold	Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper	10 µin
Samtec Inc. ESD-123-G-04	Black	0.1 in	46	Gold	Solder	Push-Pull	Through Hole	Female Socket	0.1 in	0.253 in	0.4 in	125 °C	-55 °C	Board	UL94 V-0	All	10 µin	2	Elevated Socket	Gold	Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper	10 µin
Samtec Inc. ESD-123-G-05	Black	0.1 in	46	Gold	Solder	Push-Pull	Through Hole	Female Socket	0.1 in	0.165 in	0.5 in	125 °C	-55 °C	Board	UL94 V-0	All	10 µin	2	Elevated Socket	Gold	Circular	Liquid Crystal Polymer (LCP)	Beryllium Copper	10 µin