40-6572 Series

Catalog

CONN IC DIP SOCKET ZIF 40POS TIN

Part	Material Flammability Rating	Current Rating	Termination Post Length	Pitch - Mating	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Mounting Type	Contact Material - Mating	Contact Finish Thickness - Mating	Pitch - Post	Contact Finish - Mating	Contact Material - Post	Termination	Housing Material	Contact Finish - Post	Contact Finish Thickness - Post	Row Spacing	Type	Features
Aries Electronics 40-6572-11	UL94 V-0	1 A	0.11 in	0.1 in	20	40	2	Through Hole	Beryllium Copper	200 Ąin	0.1 in	Tin	Beryllium Copper	Solder	Glass Filled Polyphenylene Sulfide PPS	Tin	200 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Closed Frame
Aries Electronics 40-6572-10	UL94 V-0	1 A	0.11 in	0.1 in	20	40	2	Through Hole	Beryllium Copper	200 Ąin	0.1 in	Tin	Beryllium Copper	Solder	Glass Filled Polyphenylene Sulfide PPS	Tin	200 µin	0.6 in	0.6" (15.24mm) Row Spacing DIP ZIF (ZIP)	Closed Frame