ESQT-113 Series
Manufacturer: Samtec Inc.
CONN SOCKET 52POS 0.079 GOLD PCB
| Part | Material Flammability Rating | Fastening Type | Operating Temperature (Max) | Operating Temperature (Min) | Contact Finish - Post | Style | Contact Length - Post | Number of Positions Loaded | Contact Finish - Mating | Row Spacing - Mating | Mounting Type | Connector Type | Termination | Contact Finish Thickness - Mating | Pitch - Mating | Number of Positions | Insulation Height | Contact Type | Number of Rows | Current Rating (Per Contact) | Insulation Color | Insulation Material | Contact Shape | Contact Material | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | UL94 V-0 | Push-Pull | 125 °C | -55 °C | Tin | Board Board or Cable | 0.09 in | All | Gold | 0.079 in | Through Hole | Elevated Socket | Solder | 20 Ąin | 0.079 in | 52 | 0.368 in | Forked | 4 | 4.5 A | Black | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | |
Samtec Inc. | UL94 V-0 | Push-Pull | 125 °C | -55 °C | Tin | Board Board or Cable | 0.123 in | All | Gold | Through Hole | Elevated Socket | Solder | 10 µin | 0.079 in | 13 | 0.335 in | Forked | 1 | 4.5 A | Black | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | ||
Samtec Inc. | UL94 V-0 | Push-Pull | 125 °C | -55 °C | Gold | Board Board or Cable | 0.54 in | All | Gold | 0.079 in | Through Hole | Elevated Socket | Solder | 20 Ąin | 0.079 in | 26 | 0.31 in | Forked | 2 | 4.5 A | Black | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | 3 µin |
Samtec Inc. | UL94 V-0 | Push-Pull | 125 °C | -55 °C | Tin | Board Board or Cable | 0.133 in | All | Gold | 0.079 in | Through Hole | Elevated Socket | Solder | 10 µin | 0.079 in | 26 | 0.325 in | Forked | 2 | 4.5 A | Black | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | |
Samtec Inc. | UL94 V-0 | Push-Pull | 125 °C | -55 °C | Tin | Board Board or Cable | 0.35 in | All | Gold | 0.079 in | Through Hole | Elevated Socket | Solder | 10 µin | 0.079 in | 26 | 0.5 in | Forked | 2 | 4.5 A | Black | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | |
Samtec Inc. | UL94 V-0 | Push-Pull | 125 °C | -55 °C | Gold | Board Board or Cable | 0.205 in | All | Gold | 0.079 in | Through Hole | Elevated Socket | Solder | 20 Ąin | 0.079 in | 26 | 0.645 in | Forked | 2 | 4.5 A | Black | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | 3 µin |
Samtec Inc. | UL94 V-0 | Push-Pull | 125 °C | -55 °C | Tin | Board Board or Cable | 0.425 in | All | Gold | 0.079 in | Through Hole | Elevated Socket | Solder | 10 µin | 0.079 in | 26 | 0.425 in | Forked | 2 | 4.5 A | Black | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | |
Samtec Inc. | UL94 V-0 | Push-Pull | 125 °C | -55 °C | Tin | Board Board or Cable | 0.25 in | All | Gold | 0.079 in | Through Hole | Elevated Socket | Solder | 3 µin | 0.079 in | 26 | 0.6 in | Forked | 2 | 4.5 A | Black | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | |
Samtec Inc. | UL94 V-0 | Push-Pull | 125 °C | -55 °C | Tin | Board Board or Cable | 0.398 in | All | Gold | 0.079 in | Through Hole | Elevated Socket | Solder | 10 µin | 0.079 in | 26 | 0.452 in | Forked | 2 | 4.5 A | Black | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze | |
Samtec Inc. | UL94 V-0 | Push-Pull | 125 °C | -55 °C | Tin | Board Board or Cable | 0.54 in | All | Gold | 0.079 in | Through Hole | Elevated Socket | Solder | 3 µin | 0.079 in | 26 | 0.31 in | Forked | 2 | 4.5 A | Black | Liquid Crystal Polymer (LCP) | Square | Phosphor Bronze |