ESQT-113 Series

Catalog

CONN SOCKET 52POS 0.079 GOLD PCB

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Part	Operating Temperature [Min]	Operating Temperature [Max]	Insulation Material	Contact Finish - Post	Contact Length - Post	Contact Length - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Insulation Color	Fastening Type	Material Flammability Rating	Termination	Number of Positions	Contact Material	Pitch - Mating [x]	Pitch - Mating [x]	Style	Insulation Height	Insulation Height	Mounting Type	Row Spacing - Mating	Row Spacing - Mating	Number of Positions Loaded	Current Rating (Amps)	Contact Shape	Connector Type	Contact Type	Contact Length - Post [x]	Contact Length - Post [x]	Number of Rows	Contact Finish Thickness - Post	Contact Finish Thickness - Post
Samtec Inc. ESQT-113-03-M-Q-368	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Tin	0.09 "	2.29 mm	0.51 µm	20 µin	Gold	Black	Push-Pull	UL94 V-0	Solder	52	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	9.35 mm	0.368 in	Through Hole	0.079 in	2 mm	All	4.5 A	Square	Elevated Socket	Forked
Samtec Inc. ESQT-113-03-L-S-335	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Tin			0.25 çm	10 çin	Gold	Black	Push-Pull	UL94 V-0	Solder	13	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	8.51 mm	0.335 "	Through Hole			All	4.5 A	Square	Elevated Socket	Forked	3.12 mm	0.123 in	1
Samtec Inc. ESQT-113-02-GF-D-310	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Gold	0.54 in	13.72 mm	0.51 µm	20 µin	Gold	Black	Push-Pull	UL94 V-0	Solder	26	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	7.87 mm	0.31 in	Through Hole	0.079 in	2 mm	All	4.5 A	Square	Elevated Socket	Forked			2	3 µin	0.076 µm
Samtec Inc. ESQT-113-03-F-D-368	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Tin	0.09 "	2.29 mm	0.076 µm	3 µin	Gold	Black	Push-Pull	UL94 V-0	Solder	26	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	9.35 mm	0.368 in	Through Hole	0.079 in	2 mm	All	4.5 A	Square	Elevated Socket	Forked			2
Samtec Inc. ESQT-113-03-L-D-325	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Tin	0.133 in	3.38 mm	0.25 çm	10 çin	Gold	Black	Push-Pull	UL94 V-0	Solder	26	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	8.25 mm	0.325 in	Through Hole	0.079 in	2 mm	All	4.5 A	Square	Elevated Socket	Forked			2
Samtec Inc. ESQT-113-02-L-D-500	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Tin			0.25 çm	10 çin	Gold	Black	Push-Pull	UL94 V-0	Solder	26	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	12.7 mm	0.5 in	Through Hole	0.079 in	2 mm	All	4.5 A	Square	Elevated Socket	Forked	8.89 mm	0.35 in	2
Samtec Inc. ESQT-113-02-LM-D-425	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Tin	0.425 in	10.8 mm	0.25 çm	10 çin	Gold	Black	Push-Pull	UL94 V-0	Solder	26	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	10.8 mm	0.425 in	Through Hole	0.079 in	2 mm	All	4.5 A	Square	Elevated Socket	Forked			2
Samtec Inc. ESQT-113-02-F-D-600	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Tin	0.25 in	6.35 mm	0.076 µm	3 µin	Gold	Black	Push-Pull	UL94 V-0	Solder	26	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	15.24 mm	0.6 in	Through Hole	0.079 in	2 mm	All	4.5 A	Square	Elevated Socket	Forked			2
Samtec Inc. ESQT-113-02-F-D-310	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Tin	0.54 in	13.72 mm	0.076 µm	3 µin	Gold	Black	Push-Pull	UL94 V-0	Solder	26	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	7.87 mm	0.31 in	Through Hole	0.079 in	2 mm	All	4.5 A	Square	Elevated Socket	Forked			2
Samtec Inc. ESQT-113-02-L-D-408	-55 °C	125 °C	Liquid Crystal Polymer (LCP)	Tin	0.442 in	11.23 mm	0.25 çm	10 çin	Gold	Black	Push-Pull	UL94 V-0	Solder	26	Phosphor Bronze	0.079 in	2 mm	Board to Board Cable	10.36 mm	0.408 in	Through Hole	0.079 in	2 mm	All	4.5 A	Square	Elevated Socket	Forked			2