HSEC8-PV Series
Manufacturer: Samtec Inc.
STANDARD CARD EDGE CONNECTORS 0.80 MM HIGH-SPEED POWER/SIGNAL COMBO EDGE CARD CONNECTOR
| Part | Termination Rows | Material - Insulation | Mounting Type | Color | Number of Positions (Power) | Number of Positions (Normal) | Number of Positions (Total) | Card Thickness | Contact Finish Thickness | Card Type | Termination | Operating Temperature (Max) | Operating Temperature (Min) | Contact Finish | Number of Positions | Number of Bay | Read Out | Pitch | Contact Type | Gender | Number of Rows | Number of Row | Features | Contact Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 2 rows | LCP Liquid Crystal Polymer | Surface Mount Through Hole | Black | 2 | 80 | 82 | 0.062 in | 30 µin | Dual Edge Non Specified | Solder | 125 °C | -55 °C | Gold | 40 | 2 | Dual | 0.031 in | Cantilever | Female | 2 | |||
Samtec Inc. | 2 rows | LCP Liquid Crystal Polymer | Surface Mount Through Hole | Black | 4 | 80 | 84 | 0.062 in | 30 µin | Dual Edge Non Specified | Solder | 125 °C | -55 °C | Gold | 40 | 2 | Dual | 0.031 in | Cantilever | Female | 2 | 2 | Board Guide Solder Retention | Beryllium Copper |
Samtec Inc. | 2 rows | LCP Liquid Crystal Polymer | Surface Mount Through Hole | Black | 2 | 60 | 62 | 0.062 in | 30 µin | Dual Edge Non Specified | Solder | 125 °C | -55 °C | Gold | 30 | 2 | Dual | 0.031 in | Cantilever | Female | 2 | Board Guide | Beryllium Copper |