28-3552 Series

Catalog

CONN IC DIP SOCKET ZIF 28POS

Part	Material Flammability Rating	Current Rating	Termination Post Length	Contact Finish Thickness - Post	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Contact Material - Mating	Mounting Type	Termination	Contact Finish - Post	Housing Material	Pitch - Mating	Operating Temperature (Max)	Operating Temperature (Min)	Pitch - Post	Features	Row Spacing	Type	Contact Material - Post	Contact Finish Thickness - Mating	Contact Finish - Mating
Aries Electronics 28-3552-18	UL94 V-0	1 A	0.11 in	50 µin	14	28	2	Beryllium Nickel	Through Hole	Solder	Nickel Boron	Glass Filled PEEK Polyetheretherketone	0.1 in	250 °C	-55 °C	0.1 in	Closed Frame	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Beryllium Nickel	50 µin	Boron Nickel
Aries Electronics 28-3552-16	UL94 V-0	1 A	0.11 in	50 µin	14	28	2	Beryllium Copper	Through Hole	Solder	Nickel Boron	Glass Filled Polyphenylene Sulfide PPS	0.1 in			0.1 in	Closed Frame	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Beryllium Copper	50 µin	Boron Nickel