FTR-115 Series
Manufacturer: Samtec Inc.
CONN HEADER SMD 15POS 1.27MM
| Part | Contact Finish - Mating | Connector Type | Contact Finish - Post | Number of Positions Loaded | Insulation Color | Contact Finish Thickness - Mating | Style | Shrouding | Number of Positions | Insulation Material | Operating Temperature (Max) | Operating Temperature (Min) | Mounting Type | Termination | Current Rating (Per Contact) | Insulation Height | Material Flammability Rating | Contact Length - Mating | Number of Rows | Contact Shape | Contact Material | Pitch - Mating | Contact Type | Fastening Type | Contact Finish Thickness - Post | Features | Row Spacing - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Gold | Header | Tin | All | Black | 30 µin | Board | Unshrouded | 15 | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | Surface Mount | Solder | 3.1 A | 0.1 in | UL94 V-0 | 0.1 in | 1 | Square | Phosphor Bronze | 0.05 in | Male Pin | Push-Pull | |||
Samtec Inc. | Gold | Header | Gold | All | Black | 10 µin | Board | Unshrouded | 30 | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | Surface Mount | Solder | 3.1 A | 0.1 in | UL94 V-0 | 0.1 in | 2 | Square | Phosphor Bronze | 0.05 in | Male Pin | Push-Pull | 3 µin | Board Lock Pick and Place | 0.1 in |
Samtec Inc. | Gold | Header | Tin | All | Black | 30 µin | Board | Unshrouded | 15 | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | Surface Mount | Solder | 3.1 A | 0.1 in | UL94 V-0 | 0.335 in | 1 | Square | Phosphor Bronze | 0.05 in | Male Pin | Push-Pull | Pick and Place | ||
Samtec Inc. | Gold | Header | Gold | All | Black | 10 µin | Board | Unshrouded | 15 | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | Surface Mount | Solder | 3.1 A | 0.1 in | UL94 V-0 | 0.23 in | 1 | Square | Phosphor Bronze | 0.05 in | Male Pin | Push-Pull | 3 µin | ||
Samtec Inc. | Gold | Header | Gold | All | Black | 10 µin | Board | Unshrouded | 30 | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | Surface Mount | Solder | 3.1 A | 0.1 in | UL94 V-0 | 0.19 in | 2 | Square | Phosphor Bronze | 0.05 in | Male Pin | Push-Pull | 3 µin | Pick and Place | 0.1 in |
Samtec Inc. | Tin | Header | Tin | All | Black | Board | Unshrouded | 30 | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | Surface Mount | Solder | 3.1 A | 0.1 in | UL94 V-0 | 0.23 in | 2 | Square | Phosphor Bronze | 0.05 in | Male Pin | Push-Pull | Board Lock Pick and Place | 0.1 in | ||
Samtec Inc. | Gold | Header | Tin | All | Black | 10 µin | Board | Unshrouded | 30 | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | Surface Mount | Solder | 3.1 A | 0.1 in | UL94 V-0 | 0.43 in | 2 | Square | Phosphor Bronze | 0.05 in | Male Pin | Push-Pull | 0.1 in | ||
Samtec Inc. | Gold | Header | Gold | All | Black | 10 µin | Board | Unshrouded | 30 | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | Surface Mount | Solder | 3.1 A | 0.1 in | UL94 V-0 | 0.335 in | 2 | Square | Phosphor Bronze | 0.05 in | Male Pin | Push-Pull | 3 µin | 0.1 in | |
Samtec Inc. | Gold | Header | Tin | All | Black | 30 µin | Board | Unshrouded | 30 | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | Surface Mount | Solder | 3.1 A | 0.1 in | UL94 V-0 | 0.125 in | 2 | Square | Phosphor Bronze | 0.05 in | Male Pin | Push-Pull | Pick and Place | 0.1 in | |
Samtec Inc. | Gold | Header | Tin | All | Black | 30 µin | Board | Unshrouded | 30 | Liquid Crystal Polymer (LCP) | 125 °C | -55 °C | Surface Mount | Solder | 3.1 A | 0.1 in | UL94 V-0 | 0.285 in | 2 | Square | Phosphor Bronze | 0.05 in | Male Pin | Push-Pull | Pick and Place | 0.1 in |