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CONN IC DIP SOCKET 12POS GOLD
| Part | Contact Material - Mating | Contact Finish - Mating | Termination Post Length | Termination Post Length | Features | Type | Type | Type | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post [custom] | Mounting Type | Number of Positions or Pins (Grid) | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Post | Pitch - Post | Pitch - Post | Operating Temperature [Max] | Operating Temperature [Min] | Pitch - Mating | Pitch - Mating | Material Flammability Rating | Termination |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | Gold | 3.56 mm | 0.14 in | Closed Frame Elevated | 0.3 " | 7.62 mm | DIP | Glass Filled Nylon 4/6 Polyamide (PA46) | 10 çin | 0.25 çm | Brass | Through Hole | 2 6 12 | 3 A | 30 Áin | 0.76 Ám | Gold | 2.54 mm | 0.1 in | 105 ░C | -55 °C | 0.1 in | 2.54 mm | UL94 V-0 | Solder |