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CONN IC DIP SOCKET ZIF 28POS
| Part | Features | Termination Post Length | Termination Post Length | Pitch - Post | Pitch - Post | Termination | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Type | Type | Type | Contact Material - Mating | Material Flammability Rating | Number of Positions or Pins (Grid) | Contact Finish - Mating | Contact Finish - Post | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Closed Frame | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | Solder | 1.27 µm | 50 µin | Beryllium Nickel | 1.27 µm | 50 µin | Through Hole | 1 A | 0.1 in | 2.54 mm | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Beryllium Nickel | UL94 V-0 | 28 | Nickel Boron | Nickel Boron | Polyphenylene Sulfide (PPS) Glass Filled |
Aries Electronics | Closed Frame | 0.11 in | 2.78 mm | 2.54 mm | 0.1 in | Solder | 0.25 çm | 10 çin | Beryllium Copper | 0.25 çm | 10 çin | Through Hole | 1 A | 0.1 in | 2.54 mm | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Beryllium Copper | UL94 V-0 | 28 | Gold | Gold | Polyphenylene Sulfide (PPS) Glass Filled |