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CONN IC DIP SOCKET ZIF 28POS TIN
| Part | Pitch - Mating | Pitch - Mating | Contact Material - Post | Mounting Type | Features | Contact Material - Mating | Number of Positions or Pins (Grid) | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Material Flammability Rating | Housing Material | Termination Post Length | Termination Post Length | Termination | Current Rating (Amps) | Contact Finish - Post | Type | Type | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.1 in | 2.54 mm | Beryllium Copper | Through Hole | Closed Frame | Beryllium Copper | 28 | 2.54 mm | 0.1 in | 200 µin | 5.08 µm | 5.08 µm | 200 µin | UL94 V-0 | Polyphenylene Sulfide (PPS) Glass Filled | 0.11 in | 2.78 mm | Solder | 1 A | Tin | 15.24 mm | DIP ZIF (ZIP) | 0.6 " |