HSEC8-190 Series

Catalog

CONN EDGE DUAL FML 180POS 0.031

Part	Mounting Type	Color	Contact Material	Card Type	Number of Positions	Operating Temperature [Min]	Operating Temperature [Max]	Contact Finish Thickness	Contact Finish Thickness	Material - Insulation	Contact Finish	Termination	Number of Rows	Gender	Features	Number of Positions/Bay/Row [custom]	Pitch [x]	Pitch [x]	Card Thickness	Card Thickness	Read Out	Contact Type
Samtec Inc. HSEC8-190-01-L-DV-A-K	Surface Mount	Black	Beryllium Copper	Non Specified - Dual Edge	180	-55 °C	125 °C	10 Áin	0.25 Ám	Liquid Crystal Polymer (LCP)	Gold	Solder	2	Female	Board Guide	90	0.8 mm	0.031 in	0.062 in	1.57 mm	Dual	Cantilever
Samtec Inc. HSEC8-190-01-L-DV-A	Surface Mount	Black	Beryllium Copper	Non Specified - Dual Edge	180	-55 °C	125 °C	10 Áin	0.25 Ám	Liquid Crystal Polymer (LCP)	Gold	Solder	2	Female	Board Guide Locking Ramp	90	0.8 mm	0.031 in	0.062 in	1.57 mm	Dual	Cantilever
Samtec Inc. HSEC8-190-01-S-DV-A	Surface Mount	Black	Beryllium Copper	Non Specified - Dual Edge	180	-55 °C	125 °C	30 Áin	0.76 Ám	Liquid Crystal Polymer (LCP)	Gold	Solder	2	Female	Board Guide Locking Ramp	90	0.8 mm	0.031 in	0.062 in	1.57 mm	Dual	Cantilever
Samtec Inc. HSEC8-190-01-S-DV-A-BL-K	Surface Mount	Black	Beryllium Copper	Non Specified - Dual Edge	180	-55 °C	125 °C	30 Áin	0.76 Ám	Liquid Crystal Polymer (LCP)	Gold	Solder	2	Female	Board Guide Board Lock	90	0.8 mm	0.031 in	0.062 in	1.57 mm	Dual	Cantilever
Samtec Inc. HSEC8-190-03-L-DV-A-K	Surface Mount	Black	Beryllium Copper	Non Specified - Dual Edge	180	-55 °C	125 °C	10 Áin	0.25 Ám	Liquid Crystal Polymer (LCP)	Gold	Solder	2	Female	Board Guide	90	0.8 mm	0.031 in	0.093 in	2.36 mm	Dual	Cantilever