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CONN IC DIP SOCKET 28POS GOLD
| Part | Contact Material - Post [custom] | Number of Positions or Pins (Grid) | Operating Temperature [Max] | Operating Temperature [Min] | Features | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Pitch - Post | Pitch - Post | Material Flammability Rating | Mounting Type | Pitch - Mating | Pitch - Mating | Termination Post Length | Termination Post Length | Contact Finish - Post | Housing Material | Type | Type | Type | Contact Material - Mating | Termination |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Brass | 28 | 105 ░C | -55 °C | Closed Frame | 200 µin | 5.08 µm | 3 A | 10 çin | 0.25 çm | Gold | 2.54 mm | 0.1 in | UL94 V-0 | Through Hole | 0.1 in | 2.54 mm | 3.18 mm | 0.125 in | Tin | Glass Filled Nylon 4/6 Polyamide (PA46) | DIP | 0.6 in | 15.24 mm | Beryllium Copper | Solder |
Aries Electronics | Brass | 28 | 105 ░C | -55 °C | Closed Frame | 200 µin | 5.08 µm | 3 A | 10 çin | 0.25 çm | Gold | 2.54 mm | 0.1 in | UL94 V-0 | Through Hole | 0.1 in | 2.54 mm | 3.18 mm | 0.125 in | Tin | Glass Filled Nylon 4/6 Polyamide (PA46) | DIP | 0.6 in | 15.24 mm | Beryllium Copper | Solder |