48-6571 Series

Catalog

CONN IC DIP SOCKET ZIF 48POS

Part	Number of Positions or Pins (Grid)	Termination Post Length	Termination Post Length	Features	Type	Type	Type	Contact Material - Post	Mounting Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Contact Finish - Post	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Current Rating (Amps)	Termination	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Pitch - Post	Pitch - Post	Contact Finish - Mating	Operating Temperature [Min]	Operating Temperature [Max]
Aries Electronics 48-6571-16	48	0.11 in	2.78 mm	Closed Frame	15.24 mm	DIP ZIF (ZIP)	0.6 "	Beryllium Nickel	Through Hole	1.27 µm	50 µin	Beryllium Nickel	Nickel Boron	Polyphenylene Sulfide (PPS) Glass Filled	1.27 µm	50 µin	1 A	Solder	0.1 in	2.54 mm	UL94 V-0	2.54 mm	0.1 in	Nickel Boron
Aries Electronics 48-6571-11	48	0.11 in	2.78 mm	Closed Frame	15.24 mm	DIP ZIF (ZIP)	0.6 "	Beryllium Copper	Through Hole	0.25 çm	10 çin	Beryllium Copper	Gold	Polyphenylene Sulfide (PPS) Glass Filled	0.25 çm	10 çin	1 A	Solder	0.1 in	2.54 mm	UL94 V-0	2.54 mm	0.1 in	Gold
Aries Electronics 48-6571-18	48	0.11 in	2.78 mm	Closed Frame	15.24 mm	DIP ZIF (ZIP)	0.6 "	Beryllium Nickel	Through Hole	1.27 µm	50 µin	Beryllium Nickel	Nickel Boron	Polyetheretherketone (PEEK) Glass Filled	1.27 µm	50 µin	1 A	Solder	0.1 in	2.54 mm	UL94 V-0	2.54 mm	0.1 in	Nickel Boron	-55 °C	250 °C