CONN IC DIP SOCKET 48POS GOLD
| Part | Contact Finish - Mating | Type | Type | Type | Material Flammability Rating | Number of Positions or Pins (Grid) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination Post Length | Termination Post Length | Housing Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Mating | Features | Pitch - Post | Pitch - Post | Contact Material - Post [custom] | Mounting Type | Current Rating (Amps) | Contact Finish - Post | Contact Material - Mating | Termination |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics 48-6518-11 | Gold | DIP | 0.6 in | 15.24 mm | UL94 V-0 | 48 | 10 çin | 0.25 çm | 3.18 mm | 0.125 in | Glass Filled, Nylon 4/6, Polyamide (PA46) | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | Open Frame | 2.54 mm | 0.1 in | Brass | Through Hole | 3 A | Gold | Beryllium Copper | Solder |
Aries Electronics 48-6518-01 | Gold | DIP | 0.6 in | 15.24 mm | UL94 V-0 | 48 | 10 çin | 0.25 çm | 3.18 mm | 0.125 in | Glass Filled, Nylon 4/6, Polyamide (PA46) | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | Open Frame | 2.54 mm | 0.1 in | Brass | Through Hole | 3 A | Gold | Beryllium Copper | Solder |
Aries Electronics 48-6518-11H | Gold | DIP | 0.6 in | 15.24 mm | UL94 V-0 | 48 | 10 çin | 0.25 çm | 3.18 mm | 0.125 in | Glass Filled, Nylon 4/6, Polyamide (PA46) | 10 çin | 0.25 çm | 0.1 in | 2.54 mm | Open Frame | 2.54 mm | 0.1 in | Brass | Through Hole | 3 A | Gold | Beryllium Copper | Solder |
Aries Electronics 48-6518-10M | Gold | DIP | 0.6 in | 15.24 mm | UL94 V-0 | 48 | 10 çin | 0.25 çm | 3.18 mm | 0.125 in | Glass Filled, Nylon 4/6, Polyamide (PA46) | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Open Frame | 2.54 mm | 0.1 in | Brass | Through Hole | 3 A | Tin | Beryllium Copper | Solder |
Aries Electronics 48-6518-10H | Gold | DIP | 0.6 in | 15.24 mm | UL94 V-0 | 48 | 10 çin | 0.25 çm | 3.18 mm | 0.125 in | Glass Filled, Nylon 4/6, Polyamide (PA46) | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Open Frame | 2.54 mm | 0.1 in | Brass | Through Hole | 3 A | Tin | Beryllium Copper | Solder |
Aries Electronics 48-6518-10 | Gold | DIP | 0.6 in | 15.24 mm | UL94 V-0 | 48 | 10 çin | 0.25 çm | 3.18 mm | 0.125 in | Glass Filled, Nylon 4/6, Polyamide (PA46) | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Open Frame | 2.54 mm | 0.1 in | Brass | Through Hole | 3 A | Tin | Beryllium Copper | Solder |
Aries Electronics 48-6518-10T | Gold | DIP | 0.6 in | 15.24 mm | UL94 V-0 | 48 | 10 çin | 0.25 çm | 3.18 mm | 0.125 in | Glass Filled, Nylon 4/6, Polyamide (PA46) | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Open Frame | 2.54 mm | 0.1 in | Brass | Through Hole | 3 A | Tin | Beryllium Copper | Solder |