48-6518 Series

Catalog

CONN IC DIP SOCKET 48POS GOLD

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Pitch - Post	Pitch - Post	Contact Material - Post [custom]	Termination Post Length	Termination Post Length	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Contact Material - Mating	Current Rating (Amps)	Type	Type	Type	Material Flammability Rating	Termination	Number of Positions or Pins (Grid)	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Housing Material	Mounting Type	Contact Finish - Mating	Features
Aries Electronics 48-6518-10	10 çin	0.25 çm	2.54 mm	0.1 in	Brass	3.18 mm	0.125 in	0.1 in	2.54 mm	Tin	Beryllium Copper	3 A	DIP	0.6 in	15.24 mm	UL94 V-0	Solder	48	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	Gold	Open Frame
Aries Electronics 48-6518-10M	10 çin	0.25 çm	2.54 mm	0.1 in	Brass	3.18 mm	0.125 in	0.1 in	2.54 mm	Tin	Beryllium Copper	3 A	DIP	0.6 in	15.24 mm	UL94 V-0	Solder	48	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	Gold	Open Frame
Aries Electronics 48-6518-01	10 çin	0.25 çm	2.54 mm	0.1 in	Brass	3.18 mm	0.125 in	0.1 in	2.54 mm	Gold	Beryllium Copper	3 A	DIP	0.6 in	15.24 mm	UL94 V-0	Solder	48	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	Gold	Open Frame
Aries Electronics 48-6518-10H	10 çin	0.25 çm	2.54 mm	0.1 in	Brass	3.18 mm	0.125 in	0.1 in	2.54 mm	Tin	Beryllium Copper	3 A	DIP	0.6 in	15.24 mm	UL94 V-0	Solder	48	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	Gold	Open Frame
Aries Electronics 48-6518-10T	10 çin	0.25 çm	2.54 mm	0.1 in	Brass	3.18 mm	0.125 in	0.1 in	2.54 mm	Tin	Beryllium Copper	3 A	DIP	0.6 in	15.24 mm	UL94 V-0	Solder	48	200 µin	5.08 µm	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	Gold	Open Frame
Aries Electronics 48-6518-11	10 çin	0.25 çm	2.54 mm	0.1 in	Brass	3.18 mm	0.125 in	0.1 in	2.54 mm	Gold	Beryllium Copper	3 A	DIP	0.6 in	15.24 mm	UL94 V-0	Solder	48	10 çin	0.25 çm	Glass Filled Nylon 4/6 Polyamide (PA46)	Through Hole	Gold	Open Frame