TMM-150 Series

Catalog

2MM TERMINAL STRIP

Part	Connector Type	Pitch - Mating	Insulation Color	Contact Finish - Mating	Contact Finish - Post	Mounting Type	Number of Positions	Number of Rows	Number of Positions Loaded	Contact Finish Thickness - Mating	Contact Length - Post	Contact Material	Contact Length - Mating	Insulation Height	Style	Contact Type	Contact Shape	Current Rating (Per Contact)	Operating Temperature (Max)	Operating Temperature (Min)	Fastening Type	Row Spacing - Mating	Insulation Material	Termination	Shrouding	Number of Positions Loaded	Overall Contact Length	Contact Finish Thickness - Post
Samtec Inc. TMM-150-01-L-D-RA	Header	0.079 in	Black	Gold	Tin	Right Angle Through Hole	100	2	All	10 µin	0.12 in	Phosphor Bronze	0.126 in	0.155 in	Board Board or Cable	Male Pin	Square	3.2 A	125 °C	-55 °C	Push-Pull	0.079 in	Liquid Crystal Polymer (LCP)	Solder	Unshrouded
Samtec Inc. TMM-150-01-L-D-RA-037	Header	0.079 in	Black	Gold	Tin	Right Angle Through Hole	100	2		10 µin	0.12 in	Phosphor Bronze	0.126 in	0.155 in	Board Board or Cable	Male Pin	Square	3.2 A	125 °C	-55 °C	Push-Pull	0.079 in	Liquid Crystal Polymer (LCP)	Solder	Unshrouded	99
Samtec Inc. TMM-150-02-S-S	Header	0.079 in	Black	Gold	Tin	Through Hole	50	1	All	30 µin	0.118 in	Phosphor Bronze	0.146 in	0.059 in	Board Board or Cable	Male Pin	Square	3.2 A	125 °C	-55 °C	Push-Pull		Liquid Crystal Polymer (LCP)	Solder	Unshrouded		0.323 in
Samtec Inc. TMM-150-01-G-Q-RA	Header	0.079 in	Black	Gold	Gold	Right Angle Through Hole	200	4	All	20 Ąin	0.12 in	Phosphor Bronze	0.126 in	0.315 in	Board Board or Cable	Male Pin	Square	3.2 A	125 °C	-55 °C	Push-Pull	0.079 in	Liquid Crystal Polymer (LCP)	Solder	Unshrouded			3 µin
Samtec Inc. TMM-150-06-S-S	Header	0.079 in	Black	Gold	Tin	Through Hole	50	1	All	30 µin	0.192 in	Phosphor Bronze	0.126 in	0.059 in	Board Board or Cable	Male Pin	Square	3.2 A	125 °C	-55 °C	Push-Pull		Liquid Crystal Polymer (LCP)	Solder	Unshrouded		0.377 in
Samtec Inc. TMM-150-02-S-Q	Header	0.079 in	Black	Gold	Tin	Through Hole	200	4	All	30 µin	0.118 in	Phosphor Bronze	0.146 in	0.059 in	Board Board or Cable	Male Pin	Square	3.2 A	125 °C	-55 °C	Push-Pull	0.079 in	Liquid Crystal Polymer (LCP)	Solder	Unshrouded		0.323 in
Samtec Inc. TMM-150-03-L-S	Header	0.079 in	Black	Gold	Tin	Through Hole	50	1	All	10 µin	0.106 in	Phosphor Bronze	0.157 in	0.059 in	Board Board or Cable	Male Pin	Square	3.2 A	125 °C	-55 °C	Push-Pull		Liquid Crystal Polymer (LCP)	Solder	Unshrouded		0.323 in
Samtec Inc. TMM-150-01-G-D-001	Header	0.079 in	Black	Gold	Gold	Through Hole	100	2		20 Ąin	0.138 in	Phosphor Bronze	0.126 in	0.059 in	Board Board or Cable	Male Pin	Square	3.2 A	125 °C	-55 °C	Push-Pull	0.079 in	Liquid Crystal Polymer (LCP)	Solder	Unshrouded	99	0.323 in	3 µin
Samtec Inc. TMM-150-01-L-S-RA	Header	0.079 in	Black	Gold	Tin	Right Angle Through Hole	50	1	All	10 µin	0.12 in	Phosphor Bronze	0.126 in	0.079 in	Board Board or Cable	Male Pin	Square	3.2 A	125 °C	-55 °C	Push-Pull		Liquid Crystal Polymer (LCP)	Solder	Unshrouded
Samtec Inc. TMM-150-03-L-Q	Header	0.079 in	Black	Gold	Tin	Through Hole	200	4	All	10 µin	0.106 in	Phosphor Bronze	0.157 in	0.059 in	Board Board or Cable	Male Pin	Square	3.2 A	125 °C	-55 °C	Push-Pull	0.079 in	Liquid Crystal Polymer (LCP)	Solder	Unshrouded		0.323 in