ESHF-113 Series
Headers & Wire Housings .050" Shrouded Header For FFSD With Strain Relief
Manufacturer: Samtec Inc.
Catalog
Headers & Wire Housings .050" Shrouded Header For FFSD With Strain Relief
Headers & Wire Housings .050" Shrouded Header For FFSD With Strain Relief
Headers & Wire Housings .050" Shrouded Header For FFSD With Strain Relief
Headers & Wire Housings .050" Shrouded Header For FFSD With Strain Relief
| Part | Contact Shape | Contact Material | Style | Insulation Material | Contact Finish - Mating | Number of Positions | Insulation Color | Fastening Type | Row Spacing - Mating | Row Spacing - Mating | Number of Positions Loaded | Pitch - Mating | Pitch - Mating | Contact Length - Mating | Contact Length - Mating | Number of Rows | Contact Type | Connector Type | Insulation Height | Insulation Height | Shrouding | Termination | Contact Finish - Post | Operating Temperature [Min] | Operating Temperature [Max] | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Mounting Type | Contact Length - Post | Contact Length - Post | Insulation Height | Contact Finish Thickness - Mating | Contact Length - Post [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Square | Phosphor Bronze | Board to Cable/Wire | Liquid Crystal Polymer (LCP) | Gold | 26 | Black | Push-Pull | 0.05 in | 1.27 mm | All | 0.05 in | 1.27 mm | 3.05 mm | 0.12 in | 2 | Male Pin | Header | 5.45 mm | 0.215 in | Shrouded - 4 Wall | Solder | Tin | -55 °C | 125 °C | Keying Slot | 10 çin | 0.25 çm | Surface Mount | |||||
Samtec Inc. | Square | Phosphor Bronze | Board to Cable/Wire | Liquid Crystal Polymer (LCP) | Gold | 26 | Black | Push-Pull | 0.05 in | 1.27 mm | All | 0.05 in | 1.27 mm | 3.05 mm | 0.12 in | 2 | Male Pin | Header | 5.6 mm | Shrouded - 4 Wall | Solder | Tin | -55 °C | 125 °C | Keying Slot | 10 çin | 0.25 çm | Through Hole Right Angle | 2.16 mm | 0.085 in | 0.22 in | |||
Samtec Inc. | Square | Phosphor Bronze | Board to Cable/Wire | Liquid Crystal Polymer (LCP) | Gold | 26 | Black | Push-Pull | 0.05 in | 1.27 mm | All | 0.05 in | 1.27 mm | 3.05 mm | 0.12 in | 2 | Male Pin | Header | 5.45 mm | 0.215 in | Shrouded - 4 Wall | Solder | -55 °C | 125 °C | Keying Slot | Surface Mount | ||||||||
Samtec Inc. | Square | Phosphor Bronze | Board to Cable/Wire | Liquid Crystal Polymer (LCP) | Gold | 26 | Black | Push-Pull | 0.05 in | 1.27 mm | All | 0.05 in | 1.27 mm | 3.05 mm | 0.12 in | 2 | Male Pin | Header | 5.45 mm | 0.215 in | Shrouded - 4 Wall | Solder | Tin | -55 °C | 125 °C | Keying Slot Pick and Place | 10 çin | 0.25 çm | Surface Mount | |||||
Samtec Inc. | Square | Phosphor Bronze | Board to Cable/Wire | Liquid Crystal Polymer (LCP) | Gold | 26 | Black | Push-Pull | 0.05 in | 1.27 mm | All | 0.05 in | 1.27 mm | 3.05 mm | 0.12 in | 2 | Male Pin | Header | 5.45 mm | 0.215 in | Shrouded - 4 Wall | Solder | -55 °C | 125 °C | Keying Slot | Surface Mount | Flash | |||||||
Samtec Inc. | Square | Phosphor Bronze | Board to Cable/Wire | Liquid Crystal Polymer (LCP) | Gold | 26 | Black | Push-Pull | 0.05 in | 1.27 mm | All | 0.05 in | 1.27 mm | 3.05 mm | 0.12 in | 2 | Male Pin | Header | 5.33 mm | Shrouded - 4 Wall | Solder | -55 °C | 125 °C | Keying Slot | Through Hole | 1.91 mm | 0.21 in | Flash | 0.075 in | |||||
Samtec Inc. | Square | Phosphor Bronze | Board to Cable/Wire | Liquid Crystal Polymer (LCP) | Gold | 26 | Black | Push-Pull | 0.05 in | 1.27 mm | All | 0.05 in | 1.27 mm | 3.05 mm | 0.12 in | 2 | Male Pin | Header | 5.45 mm | 0.215 in | Shrouded - 4 Wall | Solder | Tin | -55 °C | 125 °C | Keying Slot | 10 çin | 0.25 çm | Surface Mount | |||||
Samtec Inc. | Square | Phosphor Bronze | Board to Cable/Wire | Liquid Crystal Polymer (LCP) | Gold | 26 | Black | Push-Pull | 0.05 in | 1.27 mm | All | 0.05 in | 1.27 mm | 3.05 mm | 0.12 in | 2 | Male Pin | Header | 5.45 mm | 0.215 in | Shrouded - 4 Wall | Solder | Tin | -55 °C | 125 °C | Board Lock Keying Slot | 10 çin | 0.25 çm | Surface Mount |