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CONN IC DIP SOCKET ZIF 36POS
| Part | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) | Material Flammability Rating | Termination Post Length | Termination Post Length | Contact Finish - Mating | Housing Material | Contact Material - Mating | Termination | Operating Temperature [Min] | Operating Temperature [Max] | Current Rating (Amps) | Type | Type | Type | Contact Finish - Post | Pitch - Post | Pitch - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Material - Post | Mounting Type | Features |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 0.1 in | 2.54 mm | 1.27 µm | 50 µin | 36 | UL94 V-0 | 0.11 in | 2.78 mm | Nickel Boron | Polyetheretherketone (PEEK) Glass Filled | Beryllium Nickel | Solder | -55 °C | 250 °C | 1 A | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Nickel Boron | 2.54 mm | 0.1 in | 1.27 µm | 50 µin | Beryllium Nickel | Through Hole | Closed Frame |
Aries Electronics | 0.1 in | 2.54 mm | 5.08 µm | 200 µin | 36 | UL94 V-0 | 0.11 in | 2.78 mm | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | Solder | 1 A | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Tin | 2.54 mm | 0.1 in | 5.08 µm | 200 µin | Beryllium Copper | Through Hole | Closed Frame | |||
Aries Electronics | 0.1 in | 2.54 mm | 1.27 µm | 50 µin | 36 | UL94 V-0 | 0.11 in | 2.78 mm | Nickel Boron | Polyphenylene Sulfide (PPS) Glass Filled | Beryllium Copper | Solder | 1 A | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Nickel Boron | 2.54 mm | 0.1 in | 1.27 µm | 50 µin | Beryllium Copper | Through Hole | Closed Frame |