HSEC8-150 Series
Standard Card Edge Connectors 0.80 mm High-Speed Power/Signal Combo Edge Card Connector
Manufacturer: Samtec Inc.
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Standard Card Edge Connectors 0.80 mm High-Speed Power/Signal Combo Edge Card Connector
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Standard Card Edge Connectors 0.80 mm High-Speed Power/Signal Combo Edge Card Connector
Standard Card Edge Connectors 0.80 mm High-Speed Power/Signal Combo Edge Card Connector
Standard Card Edge Connectors 0.80 mm High-Speed Power/Signal Combo Edge Card Connector
| Part | Read Out | Card Thickness | Card Thickness | Gender | Color | Contact Finish | Contact Type | Number of Positions | Contact Material | Material - Insulation | Contact Finish Thickness | Contact Finish Thickness | Operating Temperature [Min] | Operating Temperature [Max] | Termination | Number of Rows | Pitch [x] | Pitch [x] | Features | Mounting Type | Number of Positions/Bay/Row [custom] | Card Type | Termination Rows |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Dual | 0.062 in | 1.57 mm | Female | Black | Gold | Cantilever | 100 | Beryllium Copper | Liquid Crystal Polymer (LCP) | 10 Áin | 0.25 Ám | -55 °C | 125 °C | Solder | 2 | 0.8 mm | 0.031 in | Board Guide Card Guide | Surface Mount | 50 | Non Specified - Dual Edge | |
Samtec Inc. | Dual | 0.062 in | 1.57 mm | Female | Black | Gold | Cantilever | 50 | Beryllium Copper | Liquid Crystal Polymer (LCP) | 30 Áin | 0.76 Ám | -55 °C | 125 °C | Solder | 2 | 0.8 mm | 0.031 in | Board Guide Pick and Place Solder Retention | Surface Mount | 25 | Non Specified - Dual Edge | 2 |
Samtec Inc. | Dual | 0.062 in | 1.57 mm | Female | Black | Gold | Cantilever | 98 | Beryllium Copper | Liquid Crystal Polymer (LCP) | 10 Áin | 0.25 Ám | -55 °C | 125 °C | Solder | 2 | 0.8 mm | 0.031 in | Board Guide Board Lock | Surface Mount Right Angle | 49 | Non Specified - Dual Edge | |
Samtec Inc. | Dual | 0.062 in | 1.57 mm | Female | Black | Gold | Cantilever | 100 | Beryllium Copper | Liquid Crystal Polymer (LCP) | 10 Áin | 0.25 Ám | -55 °C | 125 °C | Solder | 2 | 0.8 mm | 0.031 in | Board Guide Board Lock | Surface Mount | 50 | Non Specified - Dual Edge | |
Samtec Inc. | Dual | 0.093 in | 2.36 mm | Female | Black | Gold | Cantilever | 100 | Beryllium Copper | Liquid Crystal Polymer (LCP) | 30 Áin | 0.76 Ám | -55 °C | 125 °C | Solder | 2 | 0.8 mm | 0.031 in | Board Guide | Surface Mount | 50 | Non Specified - Dual Edge | |
Samtec Inc. | Dual | 0.062 in | 1.57 mm | Female | Black | Gold | Cantilever | 98 | Beryllium Copper | Liquid Crystal Polymer (LCP) | 10 Áin | 0.25 Ám | -55 °C | 125 °C | Solder | 2 | 0.8 mm | 0.031 in | Board Guide | Surface Mount | 49 | Non Specified - Dual Edge | |
Samtec Inc. | Dual | 0.062 in | 1.57 mm | Female | Black | Gold | Cantilever | 100 | Beryllium Copper | Liquid Crystal Polymer (LCP) | 10 Áin | 0.25 Ám | -55 °C | 125 °C | Solder | 2 | 0.8 mm | 0.031 in | Board Guide Solder Retention | Surface Mount | 50 | Non Specified - Dual Edge | |
Samtec Inc. | Dual | 0.062 in | 1.57 mm | Female | Black | Gold | Cantilever | 98 | Beryllium Copper | Liquid Crystal Polymer (LCP) | 10 Áin | 0.25 Ám | -55 °C | 125 °C | Solder | 2 | 0.8 mm | 0.031 in | Board Edge Straddle Mount | 49 | Non Specified - Dual Edge | ||
Samtec Inc. | Dual | 0.062 in | 1.57 mm | Female | Black | Gold | Cantilever | 50 | Beryllium Copper | Liquid Crystal Polymer (LCP) | 30 Áin | 0.76 Ám | -55 °C | 125 °C | Solder | 2 | 0.8 mm | 0.031 in | Board Guide | Surface Mount Right Angle | 25 | Non Specified - Dual Edge | |
Samtec Inc. | Dual | 0.062 in | 1.57 mm | Female | Black | Gold | Cantilever | 100 | Beryllium Copper | Liquid Crystal Polymer (LCP) | 30 Áin | 0.76 Ám | -55 °C | 125 °C | Solder | 2 | 0.8 mm | 0.031 in | Board Guide Card Guide | Surface Mount | 50 | Non Specified - Dual Edge |