MTMS-112 Series
Manufacturer: Samtec Inc.
.050" X .100" VARIABLE POST HEIG
| Part | Shrouding | Fastening Type | Termination | Number of Positions Loaded | Mounting Type | Contact Finish Thickness - Mating | Insulation Color | Contact Finish - Mating | Operating Temperature (Max) | Operating Temperature (Min) | Connector Type | Insulation Height | Style | Contact Finish - Post | Contact Length - Post | Contact Length - Mating | Number of Rows | Insulation Material | Number of Positions | Contact Type | Contact Shape | Overall Contact Length | Pitch - Mating | Contact Material | Contact Finish Thickness - Post | Contact Finish Thickness - Post (string_set) | Row Spacing - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Unshrouded | Push-Pull | Solder | All | Through Hole | 10 µin | Black | Gold | 125 °C | -55 °C | Header | 0.1 in | Board | Gold | 0.285 in | 0.44 in | 1 | Liquid Crystal Polymer (LCP) | 12 | Male Pin | Square | 0.825 in | 0.05 in | Phosphor Bronze | Flash | Flash | |
Samtec Inc. | Unshrouded | Push-Pull | Solder | All | Through Hole | 10 µin | Black | Gold | 125 °C | -55 °C | Header | 0.1 in | Board | Gold | 0.14 in | 0.315 in | 2 | Liquid Crystal Polymer (LCP) | 24 pos | Male Pin | Square | 0.555 in | 0.05 in | Phosphor Bronze | Flash | Flash | 0.1 in |
Samtec Inc. | Unshrouded | Push-Pull | Solder | All | Through Hole | 10 µin | Black | Gold | 125 °C | -55 °C | Header | 0.1 in | Board | Gold | 0.145 in | 0.205 in | 1 | Liquid Crystal Polymer (LCP) | 12 | Male Pin | Square | 0.45 in | 0.05 in | Phosphor Bronze | Flash | Flash | |
Samtec Inc. | Unshrouded | Push-Pull | Solder | All | Through Hole | 10 µin | Black | Gold | 125 °C | -55 °C | Header | 0.1 in | Board | Gold | 0.105 in | 0.125 in | 1 | Liquid Crystal Polymer (LCP) | 12 | Male Pin | Square | 0.33 in | 0.05 in | Phosphor Bronze | Flash | Flash | |
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Samtec Inc. | Unshrouded | Push-Pull | Solder | All | Through Hole | 10 µin | Black | Gold | 125 °C | -55 °C | Header | 0.1 in | Board | Gold | 0.25 in | 0.1 in | 2 | Liquid Crystal Polymer (LCP) | 24 pos | Male Pin | Square | 0.45 in | 0.05 in | Phosphor Bronze | Flash | Flash | 0.1 in |
Samtec Inc. | Unshrouded | Push-Pull | Solder | All | Through Hole | 30 µin | Black | Gold | 125 °C | -55 °C | Header | 0.1 in | Board | Tin | 0.165 in | 0.24 in | 2 | Liquid Crystal Polymer (LCP) | 24 pos | Male Pin | Square | 0.505 in | 0.05 in | Phosphor Bronze | 0.1 in | ||
Samtec Inc. | Unshrouded | Push-Pull | Solder | All | Through Hole | 10 µin | Black | Gold | 125 °C | -55 °C | Header | 0.1 in | Board | Tin | 0.15 in | 0.505 in | 1 | Liquid Crystal Polymer (LCP) | 12 | Male Pin | Square | 0.755 in | 0.05 in | Phosphor Bronze | |||
Samtec Inc. | Unshrouded | Push-Pull | Solder | All | Through Hole | 10 µin | Black | Gold | 125 °C | -55 °C | Header | 0.1 in | Board | Gold | 0.12 in | 0.23 in | 2 | Liquid Crystal Polymer (LCP) | 24 pos | Male Pin | Square | 0.45 in | 0.05 in | Phosphor Bronze | Flash | Flash | 0.1 in |
Samtec Inc. | Unshrouded | Push-Pull | Solder | All | Through Hole | 10 µin | Black | Gold | 125 °C | -55 °C | Header | 0.1 in | Board | Gold | 0.12 in | 0.19 in | 1 | Liquid Crystal Polymer (LCP) | 12 | Male Pin | Square | 0.41 in | 0.05 in | Phosphor Bronze | Flash | Flash |