BDN12 Series
Manufacturer: CTS Thermal Management Products
HEATSINK CPU W/ADHESIVE 1.21"SQ
| Part | Shelf Life | Shape | Package Cooled | Thermal Resistance | Width | Material Finish | Fin Height | Length | Material | Attachment Method | Type |
|---|---|---|---|---|---|---|---|---|---|---|---|
CTS Thermal Management Products | 24 Months | Pin Fins Square | ASIC ASIC...) Assorted (BGA BGA CPU LGA | 5.2 °C/W 16.5 °C/W | 1.21 in | Black Anodized | 0.555 in | 1.21 in | Aluminum | Adhesive (Included) Thermal Tape | Top Mount |
CTS Thermal Management Products | 24 Months | Pin Fins Square | ASIC ASIC...) Assorted (BGA BGA CPU LGA | 6.8 °C/W 19.6 °C/W | 1.21 in | Black Anodized | 0.355 in | 1.21 in | Aluminum | Adhesive (Included) Thermal Tape | Top Mount |