TST-102 Series

Catalog

SHROUDED PCB HEADERS, 0.100" PIT

Part	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Insulation Height [custom]	Insulation Height [custom]	Insulation Color	Termination	Style	Pitch - Mating	Pitch - Mating	Contact Finish - Mating	Number of Positions	Mounting Type	Number of Positions Loaded [custom]	Overall Contact Length	Overall Contact Length	Number of Rows	Operating Temperature [Min]	Operating Temperature [Max]	Contact Length - Mating	Contact Length - Mating	Contact Shape	Contact Finish - Post	Contact Length - Post [x]	Contact Length - Post [x]	Insulation Material	Features	Contact Material	Fastening Type	Contact Type	Shrouding	Connector Type	Contact Length - Post	Contact Length - Post	Number of Positions Loaded	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Number of Positions Loaded	Contact Finish Thickness - Mating
Samtec Inc. TST-102-02-G-S-02	10 çin	0.25 çm	UL94 V-0	3 µin	0.076 µm	0.35 in	8.89 mm	Black	Solder	Board to Cable/Wire	0.1 in	2.54 mm	Gold	2	Through Hole	1	13.46 mm	0.53 in	1	-55 °C	125 °C	6.35 mm	0.25 in	Square	Gold	0.165 in	4.19 mm	Polybutylene Terephthalate (PBT) Glass Filled	Keying Slot	Phosphor Bronze	Push-Pull	Male Pin	Shrouded - 4 Wall	Header
Samtec Inc. TST-102-01-S-D	30 Áin	0.76 Ám	UL94 V-0			0.35 in	8.89 mm	Black	Solder	Board to Cable/Wire	0.1 in	2.54 mm	Gold	4	Through Hole		12.19 mm	0.48 in	2	-55 °C	125 °C	6.35 mm	0.25 in	Square	Tin			Polybutylene Terephthalate (PBT) Glass Filled	Keying Slot	Phosphor Bronze	Push-Pull	Male Pin	Shrouded - 4 Wall	Header	2.92 mm	0.115 in	All	2.54 mm	0.1 in
Samtec Inc. TST-102-03-S-D-04	30 Áin	0.76 Ám	UL94 V-0			0.35 in	8.89 mm	Black	Solder	Board to Cable/Wire	0.1 in	2.54 mm	Gold	4	Through Hole		23.62 mm	0.93 in	2	-55 °C	125 °C	6.35 mm	0.25 in	Square	Tin			Polybutylene Terephthalate (PBT) Glass Filled	Keying Slot	Phosphor Bronze	Push-Pull	Male Pin	Shrouded - 4 Wall	Header	14.35 mm	0.565 in		2.54 mm	0.1 in	3
Samtec Inc. TST-102-01-G-S	10 çin	0.25 çm	UL94 V-0	3 µin	0.076 µm	0.35 in	8.89 mm	Black	Solder	Board to Cable/Wire	0.1 in	2.54 mm	Gold	2	Through Hole		12.19 mm	0.48 in	1	-55 °C	125 °C	6.35 mm	0.25 in	Square	Gold			Polybutylene Terephthalate (PBT) Glass Filled	Keying Slot	Phosphor Bronze	Push-Pull	Male Pin	Shrouded - 4 Wall	Header	2.92 mm	0.115 in	All
Samtec Inc. TST-102-02-G-S	10 çin	0.25 çm	UL94 V-0	3 µin	0.076 µm	0.35 in	8.89 mm	Black	Solder	Board to Cable/Wire	0.1 in	2.54 mm	Gold	2	Through Hole		13.46 mm	0.53 in	1	-55 °C	125 °C	6.35 mm	0.25 in	Square	Gold	0.165 in	4.19 mm	Polybutylene Terephthalate (PBT) Glass Filled	Keying Slot	Phosphor Bronze	Push-Pull	Male Pin	Shrouded - 4 Wall	Header			All
Samtec Inc. TST-102-01-F-D			UL94 V-0			0.35 in	8.89 mm	Black	Solder	Board to Cable/Wire	0.1 in	2.54 mm	Gold	4	Through Hole		12.19 mm	0.48 in	2	-55 °C	125 °C	6.35 mm	0.25 in	Square	Tin			Polybutylene Terephthalate (PBT) Glass Filled	Keying Slot	Phosphor Bronze	Push-Pull	Male Pin	Shrouded - 4 Wall	Header	2.92 mm	0.115 in	All	2.54 mm	0.1 in		Flash
Samtec Inc. TST-102-02-S-D	30 Áin	0.76 Ám	UL94 V-0			0.35 in	8.89 mm	Black	Solder	Board to Cable/Wire	0.1 in	2.54 mm	Gold	4	Through Hole		13.46 mm	0.53 in	2	-55 °C	125 °C	6.35 mm	0.25 in	Square	Tin	0.165 in	4.19 mm	Polybutylene Terephthalate (PBT) Glass Filled	Keying Slot	Phosphor Bronze	Push-Pull	Male Pin	Shrouded - 4 Wall	Header			All	2.54 mm	0.1 in