SDL-119 Series

Catalog

CONN RCPT 38POS 0.1 GOLD PCB

Part	Termination	Pitch - Mating	Contact Finish - Mating	Connector Type	Number of Positions	Fastening Type	Contact Type	Row Spacing - Mating	Mounting Type	Number of Rows	Contact Length - Post	Number of Positions Loaded	Operating Temperature (Max)	Operating Temperature (Min)	Insulation Height	Style	Insulation Color	Contact Finish Thickness - Mating	Contact Shape	Contact Material	Insulation Material	Contact Finish - Post	Contact Finish Thickness - Post
Samtec Inc. SDL-119-T-10	Solder	0.1 in	Gold	Receptacle	38	Push-Pull	Female Socket	0.1 in	Through Hole	2	0.108 in	All	125 °C	-55 °C	0.122 in	Board	Black	30 µin	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)
Samtec Inc. SDL-119-TT-12	Solder	0.1 in	Tin	Receptacle	38	Push-Pull	Female Socket	0.1 in	Through Hole	2	0.095 in	All	105 °C	-55 °C	0.095 in	Board	Black		Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)	Tin
Samtec Inc. SDL-119-T-11	Solder	0.1 in	Gold	Receptacle	38	Push-Pull	Female Socket	0.1 in	Through Hole	2	0.108 in	All	125 °C	-55 °C	0.132 in	Board	Black	30 µin	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)
Samtec Inc. SDL-119-TT-10	Solder	0.1 in	Tin	Receptacle	38	Push-Pull	Female Socket	0.1 in	Through Hole	2	0.108 in	All	105 °C	-55 °C	0.122 in	Board	Black		Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)	Tin
Samtec Inc. SDL-119-TT-11	Solder	0.1 in	Tin	Receptacle	38	Push-Pull	Female Socket	0.1 in	Through Hole	2	0.108 in	All	105 °C	-55 °C	0.132 in	Board	Black		Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)	Tin
Samtec Inc. SDL-119-G-12	Solder	0.1 in	Gold	Receptacle	38	Push-Pull	Female Socket	0.1 in	Through Hole	2	0.095 in	All	125 °C	-55 °C	0.095 in	Board	Black	30 µin	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)	Gold	10 µin
Samtec Inc. SDL-119-G-19	Solder	0.1 in	Gold	Receptacle	38	Push-Pull	Female Socket	0.1 in	Through Hole	2	0.082 in	All	125 °C	-55 °C	0.083 in	Board	Black	30 µin	Circular	Beryllium Copper	Liquid Crystal Polymer (LCP)	Gold	10 µin