18-0518 Series

Catalog

CONN SOCKET SIP 18POS GOLD

Part	Contact Finish - Post	Pitch - Mating	Pitch - Mating	Contact Material - Post [custom]	Housing Material	Pitch - Post	Pitch - Post	Termination Post Length	Termination Post Length	Contact Material - Mating	Termination	Current Rating (Amps)	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish - Mating	Mounting Type	Features	Material Flammability Rating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Termination Post Length [x]	Termination Post Length [x]
Aries Electronics 18-0518-10H	Tin	0.1 in	2.54 mm	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	3.18 mm	0.125 in	Beryllium Copper	Solder	3 A	SIP	10 çin	0.25 çm	Gold	Through Hole	Open Frame	UL94 V-0	200 µin	5.08 µm	18	1 x 18
Aries Electronics 18-0518-11	Gold	0.1 in	2.54 mm	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	3.18 mm	0.125 in	Beryllium Copper	Solder	3 A	SIP	10 çin	0.25 çm	Gold	Through Hole	Open Frame	UL94 V-0	10 çin	0.25 çm	18	1 x 18
Aries Electronics 18-0518-00	Tin	0.1 in	2.54 mm	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in			Beryllium Copper	Solder	3 A	SIP	10 çin	0.25 çm	Gold	Surface Mount	Open Frame	UL94 V-0	200 µin	5.08 µm	18	1 x 18	0.046 in	1.17 mm
Aries Electronics 18-0518-11H	Gold	0.1 in	2.54 mm	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	3.18 mm	0.125 in	Beryllium Copper	Solder	3 A	SIP	10 çin	0.25 çm	Gold	Through Hole	Open Frame	UL94 V-0	10 çin	0.25 çm	18	1 x 18
Aries Electronics 18-0518-10	Tin	0.1 in	2.54 mm	Brass	Glass Filled Nylon 4/6 Polyamide (PA46)	2.54 mm	0.1 in	3.18 mm	0.125 in	Beryllium Copper	Solder	3 A	SIP	10 çin	0.25 çm	Gold	Through Hole	Open Frame	UL94 V-0	200 µin	5.08 µm	18	1 x 18