Zenode.ai Logo

JAN1N4248-Rectifier-Diode Series

Diode 800V, 1A Through Hole A, Axial

Manufacturer: Microchip Technology

Catalog

Diode 800V, 1A Through Hole A, Axial

PartQualificationVoltage - Forward (Vf) (Max) @ IfSupplier Device PackageCurrent - Reverse Leakage @ VrSpeedSpeedVoltage - DC Reverse (Vr) (Max) [Max]Current - Average Rectified (Io)Operating Temperature - Junction [Max]Operating Temperature - Junction [Min]TechnologyGradePackage / CaseMounting TypeReverse Recovery Time (trr)
Microchip Technology
JAN1N4248
Microchip Technology
JAN1N4248
MIL-PRF-19500/286
1.3 V
A, Axial
1 µA
Standard Recovery >500ns
200 mA
800 V
1 A
175 ░C
-65 C
Standard
Military
A, Axial
Through Hole
5 µs
Microchip Technology
JAN1N4248/TR
MIL-PRF-19500/286
1.3 V
A, Axial
1 µA
Standard Recovery >500ns
200 mA
800 V
1 A
175 ░C
-65 C
Standard
Military
A, Axial
Through Hole
5 µs

Key Features

- Popular JEDEC registered 1N4245 to 1N4249 series.
- Voidless hermetically sealed glass package.
- Internal "Category I" Metallurgical bonds.
- Working Peak Reverse Voltage 200 to 1000 Volts.
- JAN, JANTX, and JANTXV available per MIL-PRF-19500/286 (for JANS, see 1N5614-5622 series)
- Surface mount equivalents also available in a square end-cap MELF configuration with "US" suffix (see separate data sheet for 1N5614US thru 1N5622US).

Description

AI
This "standard recovery" rectifier diode series is military qualified to MIL-PRF-19500/286 and is ideal for high-reliability applications where a failure cannot be tolerated. These industry-recognized 1.0 Amp rated rectifiers for working peak reverse voltages from 200 to 1000 volts are hermetically sealed with voidless-glass construction using an internal "Category I" metallurgical bond. These devices are similar in ratings to the 1N5614 thru 1N5622 series where surface mount MELF package configurations are available by adding a "US" suffix (see separate data sheet for 1N5614US thru 1N5622US). Microchip also offers numerous other rectifier products to meet higher and lower current ratings with various recovery time speed requirements including fast and ultrafast device types in both throughhole and surface mount packages.