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CONN SOCKET PGA ZIF GOLD
| Part | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Mounting Type | Contact Material - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Termination | Current Rating (Amps) | Type | Material Flammability Rating | Contact Material - Post | Termination Post Length | Termination Post Length | Contact Finish - Mating | Pitch - Post | Pitch - Post | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 200 µin | 5.08 µm | Closed Frame | Through Hole | Beryllium Copper | 125 °C | -65 ░C | Solder | 1 A | PGA ZIF (ZIP) | UL94 V-0 | Beryllium Copper | 3.18 mm | 0.125 in | Gold | 2.54 mm | 0.1 in | Tin | 0.1 in | 2.54 mm | 30 Áin | 0.76 Ám |