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SOLDER PASTE NO CLEAN 500GM
| Part | Melting Point [Min] | Melting Point [Min] | Melting Point [Max] | Melting Point [Max] | Shelf Life Start | Shipping Info | Mesh Type | Composition | Type | Shelf Life | Storage/Refrigeration Temperature [Min] | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Max] | Storage/Refrigeration Temperature [Min] | Form | Form | Flux Type | Form |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Kester Solder | 217 °C | 423 °F | 218 °C | 424 °F | Date of Manufacture | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | 5 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | 6 Months | 0 °C | 50 °F | 10 °C | 0 °C | Jar | 17.64 oz 500 g | No-Clean | |
Kester Solder | 217 °C | 423 °F | 218 °C | 424 °F | Date of Manufacture | Ships with Cold Pack. To ensure customer satisfaction and product integrity air shipment is recommended. | 5 | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Solder Paste | 6 Months | 0 °C | 50 °F | 10 °C | 0 °C | Cartridge | 600 g | No-Clean | 21.16 oz |