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CONN IC DIP SOCKET 16POS GOLD
| Part | Pitch - Post | Pitch - Post | Contact Material - Mating | Housing Material | Operating Temperature [Max] | Operating Temperature [Min] | Contact Finish - Post | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Mating | Current Rating (Amps) | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Features | Contact Material - Post [custom] | Material Flammability Rating | Termination | Mounting Type | Type | Type | Type | Termination Post Length | Termination Post Length | Number of Positions or Pins (Grid) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 2.54 mm | 0.1 in | Beryllium Copper | Glass Filled Nylon 4/6 Polyamide (PA46) | 105 ░C | -55 °C | Gold | 0.1 in | 2.54 mm | 10 çin | 0.25 çm | Gold | 3 A | 30 Áin | 0.76 Ám | Closed Frame Elevated | Brass | UL94 V-0 | Solder | Through Hole | DIP | 0.6 in | 15.24 mm | 3.56 mm | 0.14 in | 16 |