ESW-131 Series
Manufacturer: Samtec Inc.
CONN SOCKET 62POS 0.1 GOLD PCB
| Part | Insulation Height | Operating Temperature (Max) | Operating Temperature (Min) | Number of Positions Loaded | Mounting Type | Contact Finish Thickness - Mating | Contact Type | Row Spacing - Mating | Insulation Color | Style | Fastening Type | Number of Rows | Material Flammability Rating | Number of Positions | Voltage Rating | Termination | Pitch - Mating | Connector Type | Current Rating (Per Contact) | Contact Finish - Post | Contact Finish - Mating | Contact Length - Post | Contact Shape | Insulation Material | Contact Material | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.635 in | 125 °C | -55 °C | All | Through Hole | 30 µin | Forked | 0.1 in | Black | Board | Push-Pull | 2 | UL94 V-0 | 62 | 550 V | Solder | 0.1 in | Elevated Socket | 5.2 A | Tin | Gold | 0.28 in | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | |
Samtec Inc. | 0.535 in | 125 °C | -55 °C | All | Through Hole | 20 Ąin | Forked | 0.1 in | Black | Board | Push-Pull | 2 | UL94 V-0 | 62 | 550 V | Solder | 0.1 in | Elevated Socket | 5.2 A | Gold | Gold | 0.19 in | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | 3 µin |
Samtec Inc. | 0.735 in | 125 °C | -55 °C | All | Through Hole | 30 µin | Forked | Black | Board | Push-Pull | 1 | UL94 V-0 | 31 | 550 V | Solder | 0.1 in | Elevated Socket | 5.2 A | Tin | Gold | 0.18 in | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | ||
Samtec Inc. | 0.435 in | 105 °C | -55 °C | All | Through Hole | Forked | Black | Board | Push-Pull | 1 | UL94 V-0 | 31 | 550 V | Solder | 0.1 in | Elevated Socket | 5.2 A | Tin | Tin | 0.09 in | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | |||
Samtec Inc. | 0.535 in | 105 °C | -55 °C | All | Through Hole | Forked | 0.1 in | Black | Board | Push-Pull | 2 | UL94 V-0 | 62 | 550 V | Solder | 0.1 in | Elevated Socket | 5.2 A | Tin | Tin | 0.19 in | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | ||
Samtec Inc. | 0.635 in | 125 °C | -55 °C | All | Through Hole | 30 µin | Forked | 0.1 in | Black | Board | Push-Pull | 2 | UL94 V-0 | 62 | 550 V | Solder | 0.1 in | Elevated Socket | 5.2 A | Tin | Gold | 0.28 in | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | |
Samtec Inc. | 0.435 in | 125 °C | -55 °C | All | Through Hole | 20 Ąin | Forked | Black | Board | Push-Pull | 1 | UL94 V-0 | 31 | 550 V | Solder | 0.1 in | Elevated Socket | 5.2 A | Gold | Gold | 0.09 in | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | 3 µin | |
Samtec Inc. | 0.635 in | 105 °C | -55 °C | All | Through Hole | Forked | Black | Board | Push-Pull | 1 | UL94 V-0 | 31 | 550 V | Solder | 0.1 in | Elevated Socket | 5.2 A | Tin | Tin | 0.28 in | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | |||
Samtec Inc. | 0.435 in | 125 °C | -55 °C | All | Through Hole | 30 µin | Forked | 0.1 in | Black | Board | Push-Pull | 2 | UL94 V-0 | 62 | 550 V | Solder | 0.1 in | Elevated Socket | 5.2 A | Tin | Gold | 0.29 in | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze | |
Samtec Inc. | 0.635 in | 125 °C | -55 °C | All | Through Hole | 30 µin | Forked | 0.1 in | Black | Board | Push-Pull | 2 | UL94 V-0 | 62 | 550 V | Solder | 0.1 in | Elevated Socket | 5.2 A | Tin | Gold | 0.09 in | Square | Liquid Crystal Polymer (LCP) | Phosphor Bronze |