0.8MM 3.18MM DOUBLE ROW GOLD 2.6A -55℃~+125℃ 30P VERTICAL WELDING 4.5MM SMD,P=0.8MM FEMALE HEADERS ROHS
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Row Spacing - Mating | Row Spacing - Mating | Mated Stacking Heights | Mounting Type | Contact Finish - Mating | Number of Rows | Contact Finish Thickness - Post | Connector Type | Contact Material | Termination | Number of Positions Loaded | Contact Finish - Post | Fastening Type | Pitch - Mating | Pitch - Mating | Number of Positions | Features | Insulation Material | Contact Shape | Insulation Color | Insulation Height | Insulation Height | Operating Temperature [Min] | Operating Temperature [Max] | Contact Type | Current Rating (Amps) | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 30 Áin | 0.76 Ám | 3.18 mm | 0.125 in | 6 mm 7 mm 10 mm | Surface Mount | Gold | 2 | Flash | Receptacle | Beryllium Copper | Solder | All | Gold | Push-Pull | 0.031 in | 0.8 mm | 30 | Board Guide | Liquid Crystal Polymer (LCP) | Square | Black | 0.177 in | 4.5 mm | -55 °C | 125 °C | Female Socket | 2.6 A | |
Samtec Inc. | 30 Áin | 0.76 Ám | 3.18 mm | 0.125 in | 6 mm 7 mm 10 mm | Surface Mount | Gold | 2 | Flash | Receptacle | Beryllium Copper | Solder | All | Gold | Push-Pull | 0.031 in | 0.8 mm | 30 | Solder Retention | Liquid Crystal Polymer (LCP) | Square | Black | 0.177 in | 4.5 mm | -55 °C | 125 °C | Female Socket | 2.6 A | |
Samtec Inc. | 30 Áin | 0.76 Ám | 3.18 mm | 0.125 in | 6 mm 7 mm 10 mm | Surface Mount | Gold | 2 | Flash | Receptacle | Beryllium Copper | Solder | All | Gold | Push-Pull | 0.031 in | 0.8 mm | 30 | Pick and Place | Liquid Crystal Polymer (LCP) | Square | Black | 0.177 in | 4.5 mm | -55 °C | 125 °C | Female Socket | 2.6 A | |
Samtec Inc. | 30 Áin | 0.76 Ám | 3.18 mm | 0.125 in | 6 mm 7 mm 10 mm | Surface Mount | Gold | 2 | Flash | Receptacle | Beryllium Copper | Solder | All | Gold | Push-Pull | 0.031 in | 0.8 mm | 30 | Board Lock Pick and Place | Liquid Crystal Polymer (LCP) | Square | Black | 0.177 in | 4.5 mm | -55 °C | 125 °C | Female Socket | 2.6 A | |
Samtec Inc. | 10 çin | 0.25 çm | 3.18 mm | 0.125 in | 6 mm 7 mm 10 mm | Surface Mount | Gold | 2 | Flash | Receptacle | Beryllium Copper | Solder | All | Gold | Push-Pull | 0.031 in | 0.8 mm | 30 | Board Guide | Liquid Crystal Polymer (LCP) | Square | Black | 0.177 in | 4.5 mm | -55 °C | 125 °C | Female Socket | 2.6 A | |
Samtec Inc. | 3.18 mm | 0.125 in | 6 mm 7 mm 10 mm | Surface Mount | Gold | 2 | Receptacle | Beryllium Copper | Solder | All | Push-Pull | 0.031 in | 0.8 mm | 30 | Solder Retention | Liquid Crystal Polymer (LCP) | Square | Black | 0.177 in | 4.5 mm | -55 °C | 125 °C | Female Socket | 2.6 A | Flash |