ESW-103 Series

Catalog

CONN SOCKET 3POS 0.1 GOLD PCB

Part	Contact Shape	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Termination	Number of Rows	Contact Finish - Mating	Material Flammability Rating	Insulation Color	Fastening Type	Pitch - Mating	Pitch - Mating	Insulation Material	Contact Type	Insulation Height	Insulation Height	Voltage Rating	Number of Positions Loaded	Current Rating (Amps)	Contact Material	Operating Temperature [Min]	Operating Temperature [Max]	Connector Type	Contact Finish - Post	Row Spacing - Mating [x]	Row Spacing - Mating [x]	Number of Positions	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Length - Post	Contact Length - Post	Number of Positions Loaded
Samtec Inc. ESW-103-34-S-S	Square	30 Áin	0.76 Ám	Through Hole	Solder	1	Gold	UL94 V-0	Black	Push-Pull	0.1 in	2.54 mm	Liquid Crystal Polymer (LCP)	Forked	16.13 mm	0.635 in	550 VAC	All	5.2 A	Phosphor Bronze	-55 °C	125 °C	Elevated Socket	Tin
Samtec Inc. ESW-103-34-G-D	Square	20 µin	0.51 µm	Through Hole	Solder	2	Gold	UL94 V-0	Black	Push-Pull	0.1 in	2.54 mm	Liquid Crystal Polymer (LCP)	Forked	16.13 mm	0.635 in	550 VAC	All	5.2 A	Phosphor Bronze	-55 °C	125 °C	Elevated Socket	Gold	2.54 mm	0.1 in	6	3 µin	0.076 µm
Samtec Inc. ESW-103-23-T-D	Square			Through Hole	Solder	2		UL94 V-0	Black	Push-Pull	0.1 in	2.54 mm	Liquid Crystal Polymer (LCP)	Forked	13.6 mm	0.535 in	550 VAC	All	5.2 A	Phosphor Bronze	-55 °C	105 ░C	Elevated Socket	Tin	2.54 mm	0.1 in	6			4.83 mm	0.19 in
Samtec Inc. ESW-103-49-S-S	Square	30 Áin	0.76 Ám	Through Hole	Solder	1	Gold	UL94 V-0	Black	Push-Pull	0.1 in	2.54 mm	Liquid Crystal Polymer (LCP)	Forked	13.6 mm	0.535 in	550 VAC	All	5.2 A	Phosphor Bronze	-55 °C	125 °C	Elevated Socket	Tin						9.65 mm	0.38 in
Samtec Inc. ESW-103-58-G-S	Square	20 µin	0.51 µm	Through Hole	Solder	1	Gold	UL94 V-0	Black	Push-Pull	0.1 in	2.54 mm	Liquid Crystal Polymer (LCP)	Forked	16.13 mm	0.635 in	550 VAC	All	5.2 A	Phosphor Bronze	-55 °C	125 °C	Elevated Socket	Gold				3 µin	0.076 µm	2.29 mm	0.09 "
Samtec Inc. ESW-103-33-T-S	Square			Through Hole	Solder	1		UL94 V-0	Black	Push-Pull	0.1 in	2.54 mm	Liquid Crystal Polymer (LCP)	Forked	16.13 mm	0.635 in	550 VAC	All	5.2 A	Phosphor Bronze	-55 °C	105 ░C	Elevated Socket	Tin						2.29 mm	0.09 "
Samtec Inc. ESW-103-23-G-S-01	Square	20 µin	0.51 µm	Through Hole	Solder	1	Gold	UL94 V-0	Black	Push-Pull	0.1 in	2.54 mm	Liquid Crystal Polymer (LCP)	Forked	13.6 mm	0.535 in	550 VAC		5.2 A	Phosphor Bronze	-55 °C	125 °C	Elevated Socket	Gold				3 µin	0.076 µm	4.83 mm	0.19 in	2
Samtec Inc. ESW-103-33-L-S	Square	10 çin	0.25 çm	Through Hole	Solder	1	Gold	UL94 V-0	Black	Push-Pull	0.1 in	2.54 mm	Liquid Crystal Polymer (LCP)	Forked	16.13 mm	0.635 in	550 VAC	All	5.2 A	Phosphor Bronze	-55 °C	125 °C	Elevated Socket	Tin						2.29 mm	0.09 "
Samtec Inc. ESW-103-48-G-S	Square	20 µin	0.51 µm	Through Hole	Solder	1	Gold	UL94 V-0	Black	Push-Pull	0.1 in	2.54 mm	Liquid Crystal Polymer (LCP)	Forked	13.6 mm	0.535 in	550 VAC	All	5.2 A	Phosphor Bronze	-55 °C	125 °C	Elevated Socket	Gold				3 µin	0.076 µm	4.83 mm	0.19 in
Samtec Inc. ESW-103-34-S-D	Square	30 Áin	0.76 Ám	Through Hole	Solder	2	Gold	UL94 V-0	Black	Push-Pull	0.1 in	2.54 mm	Liquid Crystal Polymer (LCP)	Forked	16.13 mm	0.635 in	550 VAC	All	5.2 A	Phosphor Bronze	-55 °C	125 °C	Elevated Socket	Tin	2.54 mm	0.1 in	6