ESW-103 Series
Manufacturer: Samtec Inc.
CONN SOCKET 3POS 0.1 GOLD PCB
| Part | Contact Finish Thickness - Mating | Termination | Contact Length - Post | Number of Positions Loaded | Insulation Color | Contact Finish - Post | Operating Temperature (Max) | Operating Temperature (Min) | Contact Type | Current Rating (Per Contact) | Number of Positions | Insulation Height | Number of Rows | Pitch - Mating | Connector Type | Style | Material Flammability Rating | Voltage Rating | Contact Finish - Mating | Fastening Type | Mounting Type | Contact Material | Insulation Material | Contact Shape | Row Spacing - Mating | Contact Finish Thickness - Post | Number of Positions Loaded |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 30 µin | Solder | 0.28 in | All | Black | Tin | 125 °C | -55 °C | Forked | 5.2 A | 3 | 0.635 in | 1 | 0.1 in | Elevated Socket | Board | UL94 V-0 | 550 V | Gold | Push-Pull | Through Hole | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | |||
Samtec Inc. | 20 Ąin | Solder | 0.28 in | All | Black | Gold | 125 °C | -55 °C | Forked | 5.2 A | 6 | 0.635 in | 2 | 0.1 in | Elevated Socket | Board | UL94 V-0 | 550 V | Gold | Push-Pull | Through Hole | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 0.1 in | 3 µin | |
Samtec Inc. | Solder | 0.19 in | All | Black | Tin | 105 °C | -55 °C | Forked | 5.2 A | 6 | 0.535 in | 2 | 0.1 in | Elevated Socket | Board | UL94 V-0 | 550 V | Tin | Push-Pull | Through Hole | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 0.1 in | |||
Samtec Inc. | 30 µin | Solder | 0.38 in | All | Black | Tin | 125 °C | -55 °C | Forked | 5.2 A | 3 | 0.535 in | 1 | 0.1 in | Elevated Socket | Board | UL94 V-0 | 550 V | Gold | Push-Pull | Through Hole | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | |||
Samtec Inc. | 10 µin | Solder | 0.38 in | Black | Tin | 125 °C | -55 °C | Forked | 5.2 A | 3 | 0.535 in | 1 | 0.1 in | Elevated Socket | Board | UL94 V-0 | 550 V | Gold | Push-Pull | Through Hole | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 2 | |||
Samtec Inc. | 20 Ąin | Solder | 0.09 in | All | Black | Gold | 125 °C | -55 °C | Forked | 5.2 A | 3 | 0.635 in | 1 | 0.1 in | Elevated Socket | Board | UL94 V-0 | 550 V | Gold | Push-Pull | Through Hole | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 3 µin | ||
Samtec Inc. | Solder | 0.09 in | All | Black | Tin | 105 °C | -55 °C | Forked | 5.2 A | 3 | 0.635 in | 1 | 0.1 in | Elevated Socket | Board | UL94 V-0 | 550 V | Tin | Push-Pull | Through Hole | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | ||||
Samtec Inc. | 20 Ąin | Solder | 0.19 in | Black | Gold | 125 °C | -55 °C | Forked | 5.2 A | 3 | 0.535 in | 1 | 0.1 in | Elevated Socket | Board | UL94 V-0 | 550 V | Gold | Push-Pull | Through Hole | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 3 µin | 2 | ||
Samtec Inc. | Solder | 0.38 in | All | Black | Tin | 105 °C | -55 °C | Forked | 5.2 A | 3 | 0.535 in | 1 | 0.1 in | Elevated Socket | Board | UL94 V-0 | 550 V | Tin | Push-Pull | Through Hole | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | ||||
Samtec Inc. | 30 µin | Kinked Pin Solder | 0.19 in | All | Black | Tin | 125 °C | -55 °C | Forked | 5.2 A | 6 | 0.535 in | 2 | 0.1 in | Elevated Socket | Board | UL94 V-0 | 550 V | Gold | Push-Pull | Through Hole | Phosphor Bronze | Liquid Crystal Polymer (LCP) | Square | 0.1 in |