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CONN IC DIP SOCKET 20POS GOLD
| Part | Contact Material - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions or Pins (Grid) | Contact Finish - Post | Termination | Contact Material - Post [custom] | Operating Temperature [Max] | Operating Temperature [Min] | Termination Post Length | Termination Post Length | Material Flammability Rating | Current Rating (Amps) | Pitch - Mating | Pitch - Mating | Housing Material | Mounting Type | Pitch - Post | Pitch - Post | Type | Type | Type | Contact Finish - Mating | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | 10 çin | 0.25 çm | 20 | Gold | Solder | Brass | 105 ░C | -55 °C | 3.56 mm | 0.14 in | UL94 V-0 | 3 A | 0.1 in | 2.54 mm | Glass Filled Nylon 4/6 Polyamide (PA46) | Through Hole | 2.54 mm | 0.1 in | 0.3 " | 7.62 mm | DIP | Gold | Closed Frame Elevated | 30 Áin | 0.76 Ám |