ESHF-108 Series

Catalog

CONN HEADER SMD 16POS 1.27MM

Part	Number of Rows	Contact Finish - Post	Insulation Height	Insulation Height	Contact Shape	Style	Row Spacing - Mating	Row Spacing - Mating	Contact Finish - Mating	Termination	Contact Length - Mating	Contact Length - Mating	Number of Positions Loaded	Mounting Type	Contact Material	Insulation Material	Pitch - Mating	Pitch - Mating	Insulation Color	Features	Shrouding	Operating Temperature [Min]	Operating Temperature [Max]	Connector Type	Fastening Type	Contact Type	Number of Positions	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Insulation Height	Contact Length - Post	Contact Length - Post	Contact Length - Post [x]
Samtec Inc. ESHF-108-01-S-D-SM-LC	2	Tin	5.45 mm	0.215 in	Square	Board to Cable/Wire	0.05 in	1.27 mm	Gold	Solder	3.05 mm	0.12 in	All	Surface Mount	Phosphor Bronze	Liquid Crystal Polymer (LCP)	0.05 in	1.27 mm	Black	Board Lock Keying Slot	Shrouded - 4 Wall	-55 °C	125 °C	Header	Push-Pull	Male Pin	16
Samtec Inc. ESHF-108-01-S-D-SM	2	Tin	5.45 mm	0.215 in	Square	Board to Cable/Wire	0.05 in	1.27 mm	Gold	Solder	3.05 mm	0.12 in	All	Surface Mount	Phosphor Bronze	Liquid Crystal Polymer (LCP)	0.05 in	1.27 mm	Black	Keying Slot	Shrouded - 4 Wall	-55 °C	125 °C	Header	Push-Pull	Male Pin	16
Samtec Inc. ESHF-108-01-L-D-SM-LC-K-TR	2	Tin	5.45 mm	0.215 in	Square	Board to Cable/Wire	0.05 in	1.27 mm	Gold	Solder	3.05 mm	0.12 in	All	Surface Mount	Phosphor Bronze	Liquid Crystal Polymer (LCP)	0.05 in	1.27 mm	Black	Board Lock Keying Slot Pick and Place	Shrouded - 4 Wall	-55 °C	125 °C	Header	Push-Pull	Male Pin	16	10 çin	0.25 çm
Samtec Inc. ESHF-108-01-F-D-RA	2	Tin	5.6 mm		Square	Board to Cable/Wire	0.05 in	1.27 mm	Gold	Solder	3.05 mm	0.12 in	All	Through Hole Right Angle	Phosphor Bronze	Liquid Crystal Polymer (LCP)	0.05 in	1.27 mm	Black	Keying Slot	Shrouded - 4 Wall	-55 °C	125 °C	Header	Push-Pull	Male Pin	16			Flash	0.22 in	2.16 mm	0.085 in
Samtec Inc. ESHF-108-01-F-D-TH	2	Tin	5.33 mm		Square	Board to Cable/Wire	0.05 in	1.27 mm	Gold	Solder	3.05 mm	0.12 in	All	Through Hole	Phosphor Bronze	Liquid Crystal Polymer (LCP)	0.05 in	1.27 mm	Black	Keying Slot	Shrouded - 4 Wall	-55 °C	125 °C	Header	Push-Pull	Male Pin	16			Flash	0.21 in	1.91 mm		0.075 in
Samtec Inc. ESHF-108-01-F-D-SM	2	Tin	5.45 mm	0.215 in	Square	Board to Cable/Wire	0.05 in	1.27 mm	Gold	Solder	3.05 mm	0.12 in	All	Surface Mount	Phosphor Bronze	Liquid Crystal Polymer (LCP)	0.05 in	1.27 mm	Black	Keying Slot	Shrouded - 4 Wall	-55 °C	125 °C	Header	Push-Pull	Male Pin	16			Flash
Samtec Inc. ESHF-108-01-L-D-SM-LC	2	Tin	5.45 mm	0.215 in	Square	Board to Cable/Wire	0.05 in	1.27 mm	Gold	Solder	3.05 mm	0.12 in	All	Surface Mount	Phosphor Bronze	Liquid Crystal Polymer (LCP)	0.05 in	1.27 mm	Black	Board Lock Keying Slot Pick and Place	Shrouded - 4 Wall	-55 °C	125 °C	Header	Push-Pull	Male Pin	16	10 çin	0.25 çm
Samtec Inc. ESHF-108-01-L-D-SM-LC-TR	2	Tin	5.45 mm	0.215 in	Square	Board to Cable/Wire	0.05 in	1.27 mm	Gold	Solder	3.05 mm	0.12 in	All	Surface Mount	Phosphor Bronze	Liquid Crystal Polymer (LCP)	0.05 in	1.27 mm	Black	Board Lock Keying Slot	Shrouded - 4 Wall	-55 °C	125 °C	Header	Push-Pull	Male Pin	16	10 çin	0.25 çm
Samtec Inc. ESHF-108-01-L-D-TH-TR	2	Tin	5.33 mm		Square	Board to Cable/Wire	0.05 in	1.27 mm	Gold	Solder	3.05 mm	0.12 in	All	Through Hole	Phosphor Bronze	Liquid Crystal Polymer (LCP)	0.05 in	1.27 mm	Black	Keying Slot	Shrouded - 4 Wall	-55 °C	125 °C	Header	Push-Pull	Male Pin	16	10 çin	0.25 çm		0.21 in	1.91 mm		0.075 in
Samtec Inc. ESHF-108-01-L-D-SM	2	Tin	5.45 mm	0.215 in	Square	Board to Cable/Wire	0.05 in	1.27 mm	Gold	Solder	3.05 mm	0.12 in	All	Surface Mount	Phosphor Bronze	Liquid Crystal Polymer (LCP)	0.05 in	1.27 mm	Black	Keying Slot	Shrouded - 4 Wall	-55 °C	125 °C	Header	Push-Pull	Male Pin	16	10 çin	0.25 çm