28-3570 Series

Catalog

CONN IC DIP SOCKET ZIF 28POS GLD

Part	Contact Finish - Mating	Material Flammability Rating	Pitch - Mating	Pitch - Mating	Contact Finish - Post	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Termination Post Length	Termination Post Length	Housing Material	Pitch - Post	Pitch - Post	Mounting Type	Features	Type	Type	Type	Current Rating (Amps)	Contact Material - Mating	Contact Material - Post	Number of Positions or Pins (Grid)	Termination
Aries Electronics 28-3570-11	Gold	UL94 V-0	0.1 in	2.54 mm	Gold	10 çin	0.25 çm	10 çin	0.25 çm	0.11 in	2.78 mm	Polyphenylene Sulfide (PPS) Glass Filled	2.54 mm	0.1 in	Through Hole	Closed Frame	7.62 mm	0.3 in	DIP ZIF (ZIP)	1 A	Beryllium Copper	Beryllium Copper	28	Solder
Aries Electronics 28-3570-16	Nickel Boron	UL94 V-0	0.1 in	2.54 mm	Nickel Boron	50 µin	1.27 µm	50 µin	1.27 µm	0.11 in	2.78 mm	Polyphenylene Sulfide (PPS) Glass Filled	2.54 mm	0.1 in	Through Hole	Closed Frame	7.62 mm	0.3 in	DIP ZIF (ZIP)	1 A	Beryllium Nickel	Beryllium Nickel	28	Solder
Aries Electronics 28-3570-10		UL94 V-0	0.1 in	2.54 mm	Tin	200 µin	5.08 µm	200 µin	5.08 µm	0.11 in	2.78 mm	Polyphenylene Sulfide (PPS) Glass Filled	2.54 mm	0.1 in	Through Hole	Closed Frame	7.62 mm	0.3 in	DIP ZIF (ZIP)	1 A	Beryllium Copper	Beryllium Copper	28	Solder