28-3570 Series

Catalog

CONN IC DIP SOCKET ZIF 28POS GLD

Part	Termination Post Length	Current Rating	Material Flammability Rating	Row Spacing	Type	Termination	Housing Material	Contact Material - Post	Contact Finish - Post	Contact Material - Mating	Contact Finish Thickness - Post	Contact Finish Thickness - Mating	Pitch - Mating	Contact Finish - Mating	Pitch - Post	Grid Columns	Number of Positions or Pins (Grid)	Grid Rows	Features	Mounting Type
Aries Electronics 28-3570-11	0.11 in	1 A	UL94 V-0	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Solder	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	Gold	Beryllium Copper	10 µin	10 µin	0.1 in	Gold	0.1 in	14	28	2	Closed Frame	Through Hole
Aries Electronics 28-3570-16	0.11 in	1 A	UL94 V-0	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Solder	Glass Filled Polyphenylene Sulfide PPS	Beryllium Nickel	Nickel Boron	Beryllium Nickel	50 µin	50 µin	0.1 in	Boron Nickel	0.1 in	14	28	2	Closed Frame	Through Hole
Aries Electronics 28-3570-10	0.11 in	1 A	UL94 V-0	0.3 in	0.3" (7.62mm) Row Spacing DIP ZIF (ZIP)	Solder	Glass Filled Polyphenylene Sulfide PPS	Beryllium Copper	Tin	Beryllium Copper	200 µin	200 Ąin	0.1 in	Tin	0.1 in	14	28	2	Closed Frame	Through Hole