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CONN IC DIP SOCKET ZIF 24POS GLD
| Part | Contact Finish - Post | Contact Material - Post | Housing Material | Material Flammability Rating | Termination Post Length | Termination Post Length | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Finish - Mating | Type | Type | Type | Contact Material - Mating | Mounting Type | Pitch - Post | Pitch - Post | Current Rating (Amps) | Termination | Pitch - Mating | Pitch - Mating | Features | Number of Positions or Pins (Grid) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Gold | Beryllium Copper | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | 0.11 in | 2.78 mm | 10 çin | 0.25 çm | 10 çin | 0.25 çm | Gold | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Beryllium Copper | Through Hole | 2.54 mm | 0.1 in | 1 A | Solder | 0.1 in | 2.54 mm | Closed Frame | 24 |
Aries Electronics | Nickel Boron | Beryllium Nickel | Polyphenylene Sulfide (PPS) Glass Filled | UL94 V-0 | 0.11 in | 2.78 mm | 50 µin | 1.27 µm | 50 µin | 1.27 µm | Nickel Boron | 7.62 mm | 0.3 in | DIP ZIF (ZIP) | Beryllium Nickel | Through Hole | 2.54 mm | 0.1 in | 1 A | Solder | 0.1 in | 2.54 mm | Closed Frame | 24 |