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PCIE SMT LOW PROFILE
| Part | Contact Finish Thickness | Contact Finish Thickness | Features | Card Thickness | Card Thickness | Number of Rows | Termination Rows | Contact Finish | Number of Positions/Bay/Row [custom] | Number of Positions/Bay/Row [custom] | Gender | Operating Temperature [Max] | Operating Temperature [Min] | Number of Positions | Termination | Contact Material | Material - Insulation | Mounting Type | Color | Read Out | Card Type | Pitch [x] | Pitch [x] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Amphenol ICC (FCI) | 15 µin | 0.38 µm | Solder Retention | 0.062 in | 1.57 mm | 2 | 2 | Gold | 71 | 11 | Female | 105 ░C | -55 °C | 164 | Solder | Copper Alloy | Thermoplastic Glass Filled | Surface Mount | Black | Dual | PCI Express™ | 0.039 in | 1 mm |