CONN SOCKET 56POS 0.1 GOLD PCB
| Part | Operating Temperature [Min] | Operating Temperature [Max] | Contact Finish - Post | Fastening Type | Contact Length - Post [x] | Contact Length - Post [x] | Insulation Height | Insulation Height | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Connector Type | Material Flammability Rating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Number of Positions | Contact Material | Insulation Color | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Mounting Type | Insulation Material | Number of Positions Loaded | Pitch - Mating | Pitch - Mating | Number of Rows | Contact Shape | Contact Finish - Mating | Contact Type | Insulation Height [z] | Insulation Height [z] | Contact Length - Post | Contact Length - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | -55 °C | 125 °C | Gold | Push-Pull | 0.165 in | 4.19 mm | 0.5 in | 12.7 mm | 2.54 mm | 0.1 in | Elevated Socket | UL94 V-0 | 10 çin | 0.25 çm | 56 | Beryllium Copper | Black | 10 çin | 0.25 çm | Solder | Through Hole | Liquid Crystal Polymer (LCP) | All | 0.1 in | 2.54 mm | 2 | Circular | Gold | Female Socket | ||||
Samtec Inc. | -55 °C | 125 °C | Gold | Push-Pull | 2.54 mm | 0.1 in | Elevated Socket | UL94 V-0 | 10 çin | 0.25 çm | 56 | Beryllium Copper | Black | 10 çin | 0.25 çm | Solder | Through Hole | Liquid Crystal Polymer (LCP) | All | 0.1 in | 2.54 mm | 2 | Circular | Gold | Female Socket | 0.3 in | 7.62 mm | 2.92 mm | 0.115 in | ||||
Samtec Inc. | -55 °C | 125 °C | Gold | Push-Pull | 2.54 mm | 0.1 in | Elevated Socket | UL94 V-0 | 10 çin | 0.25 çm | 56 | Beryllium Copper | Black | 10 çin | 0.25 çm | Solder | Through Hole | Liquid Crystal Polymer (LCP) | All | 0.1 in | 2.54 mm | 2 | Circular | Gold | Female Socket | 0.3 in | 7.62 mm | 3.89 mm | 0.153 in |