Beta
⌘K
CONN IC DIP SOCKET ZIF 24POS GLD
| Part | Contact Material - Post | Housing Material | Operating Temperature [Min] | Operating Temperature [Max] | Type | Termination Post Length | Termination Post Length | Termination | Pitch - Post | Pitch - Post | Material Flammability Rating | Number of Positions or Pins (Grid) | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Contact Finish - Post | Contact Finish - Mating | Current Rating (Amps) | Contact Material - Mating | Mounting Type | Features | Pitch - Mating | Pitch - Mating | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | Beryllium Copper | Glass Filled Nylon 4/6 Polyamide (PA46) | -55 °C | 125 °C | DIP ZIF (ZIP) | 0.105 in | 2.67 mm | Solder | 2.54 mm | 0.1 in | UL94 V-0 | 24 | 10 çin | 0.25 çm | Gold | Gold | 3 A | Beryllium Copper | Through Hole | Closed Frame | 0.1 in | 2.54 mm | 10 çin | 0.25 çm |