CONN HEADER SMD 168POS 0.8MM
| Part | Contact Type | Contact Finish - Post | Shrouding | Contact Finish - Mating | Pitch - Mating | Pitch - Mating | Contact Length - Mating [x] | Contact Length - Mating [x] | Mounting Type | Row Spacing - Mating | Row Spacing - Mating | Contact Shape | Features | Material Flammability Rating | Contact Material | Number of Positions | Insulation Color | Current Rating (Amps) | Termination | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Rows | Connector Type | Fastening Type | Insulation Material | Number of Positions Loaded | Operating Temperature [Min] | Operating Temperature [Max] | Insulation Height [z] | Insulation Height [z] | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Insulation Height | Insulation Height |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Male Pin | Gold | Unshrouded | Gold | 0.031 in | 0.8 mm | 1.9 mm | 0.075 in | Surface Mount | 1.2 mm | 0.047 in | Square | Board Guide End Shrouds | UL94 V-0 | Phosphor Bronze | 168 | Black | 2.7 A | Solder | 10 çin | 0.25 çm | 2 | Header | Push-Pull | Liquid Crystal Polymer (LCP) | All | -55 °C | 125 °C | 0.055 in | 1.4 mm | ||||
Samtec Inc. | Male Pin | Gold | Unshrouded | Gold | 0.031 in | 0.8 mm | 1.9 mm | 0.075 in | Surface Mount Right Angle | 1.2 mm | 0.047 in | Square | UL94 V-0 | Phosphor Bronze | 168 | Black | 2.7 A | Solder | 10 çin | 0.25 çm | 2 | Header | Push-Pull | Liquid Crystal Polymer (LCP) | All | -55 °C | 125 °C | 3 µin | 0.076 µm | 3.05 mm | 0.12 in | |||
Samtec Inc. | Male Pin | Gold | Unshrouded | Gold | 0.031 in | 0.8 mm | 1.9 mm | 0.075 in | Surface Mount | 1.2 mm | 0.047 in | Square | Board Guide | UL94 V-0 | Phosphor Bronze | 168 | Black | 2.7 A | Solder | 10 çin | 0.25 çm | 2 | Header | Push-Pull | Liquid Crystal Polymer (LCP) | All | -55 °C | 125 °C | 0.055 in | 1.4 mm |