FOLC-110 Series
Manufacturer: Samtec Inc.
CONN RCPT 40POS 0.05 GOLD SMD
| Part | Style | Number of Positions | Insulation Height | Row Spacing - Mating | Mounting Type | Contact Type | Operating Temperature (Max) | Operating Temperature (Min) | Termination | Contact Finish - Mating | Contact Finish Thickness - Mating | Number of Positions Loaded | Insulation Color | Fastening Type | Contact Finish - Post | Number of Rows | Current Rating (Per Contact) | Connector Type | Material Flammability Rating | Pitch - Mating | Features | Contact Material | Insulation Material | Contact Shape | Contact Length - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | Board | 40 | 0.178 in | 0.05 in | Surface Mount | Female Socket | 125 °C | -55 °C | Solder | Gold | 30 µin | All | Black | Push-Pull | Tin | 4 | 2.6 A | Receptacle | UL94 V-0 | 0.05 in | Board Lock | Beryllium Copper | Liquid Crystal Polymer (LCP) | Square | |
Samtec Inc. | Board | 40 | 0.178 in | 0.05 in | Surface Mount | Female Socket | 125 °C | -55 °C | Solder | Gold | 30 µin | All | Black | Push-Pull | Tin | 4 | 2.6 A | Receptacle | UL94 V-0 | 0.05 in | Board Lock | Beryllium Copper | Liquid Crystal Polymer (LCP) | Square | |
Samtec Inc. | Board | 40 | 0.18 in | 0.05 in | Through Hole | Female Socket | 125 °C | -55 °C | Solder | Gold | 10 µin | All | Black | Push-Pull | Tin | 4 | 2.6 A | Receptacle | UL94 V-0 | 0.05 in | Board Lock | Beryllium Copper | Liquid Crystal Polymer (LCP) | Square | 0.12 in |
Samtec Inc. | Board | 40 | 0.178 in | 0.05 in | Surface Mount | Female Socket | 125 °C | -55 °C | Solder | Gold | 30 µin | All | Black | Push-Pull | Tin | 4 | 2.6 A | Receptacle | UL94 V-0 | 0.05 in | Pick and Place | Beryllium Copper | Liquid Crystal Polymer (LCP) | Square | |
Samtec Inc. | Board | 40 | 0.18 in | 0.05 in | Through Hole | Female Socket | 125 °C | -55 °C | Solder | Gold | 10 µin | All | Black | Push-Pull | Tin | 4 | 2.6 A | Receptacle | UL94 V-0 | 0.05 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Square | 0.075 in | |
Samtec Inc. | Board | 40 | 0.178 in | 0.05 in | Surface Mount | Female Socket | 125 °C | -55 °C | Solder | Gold | 30 µin | All | Black | Push-Pull | Tin | 4 | 2.6 A | Receptacle | UL94 V-0 | 0.05 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Square | ||
Samtec Inc. | Board | 40 | 0.185 in | 0.05 in | Surface Mount Through Hole | Female Socket | 125 °C | -55 °C | Solder | Gold | 10 µin | All | Black | Push-Pull | Tin | 4 | 2.6 A | Receptacle | UL94 V-0 | 0.05 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Square | 0.12 in | |
Samtec Inc. | Board | 40 | 0.178 in | 0.05 in | Surface Mount | Female Socket | 125 °C | -55 °C | Solder | Gold | 30 µin | All | Black | Push-Pull | Tin | 4 | 2.6 A | Receptacle | UL94 V-0 | 0.05 in | Pick and Place | Beryllium Copper | Liquid Crystal Polymer (LCP) | Square | |
Samtec Inc. | Board | 40 | 0.18 in | 0.05 in | Through Hole | Female Socket | 125 °C | -55 °C | Solder | Gold | 30 µin | All | Black | Push-Pull | Tin | 4 | 2.6 A | Receptacle | UL94 V-0 | 0.05 in | Board Lock Pick and Place | Beryllium Copper | Liquid Crystal Polymer (LCP) | Square | 0.12 in |
Samtec Inc. | Board | 40 | 0.185 in | 0.05 in | Surface Mount Through Hole | Female Socket | 125 °C | -55 °C | Solder | Gold | 30 µin | All | Black | Push-Pull | Tin | 4 | 2.6 A | Receptacle | UL94 V-0 | 0.05 in | Beryllium Copper | Liquid Crystal Polymer (LCP) | Square | 0.075 in |