20-8770 Series
Manufacturer: Aries Electronics
Beta
⌘K
CONN IC DIP SOCKET 20POS GOLD
| Part | Material Flammability Rating | Termination Post Length | Current Rating | Operating Temperature (Min) | Operating Temperature (Max) | Contact Finish Thickness - Mating | Contact Finish - Mating | Contact Material - Mating | Row Spacing | Type | Mounting Type | Features | Contact Material - Post | Termination | Grid Rows | Grid Columns | Number of Positions or Pins (Grid) | Pitch - Post | Contact Finish - Post | Contact Finish Thickness - Post | Pitch - Mating | Housing Material |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Aries Electronics | UL94 V-0 | 0.14 in | 3 A | -55 °C | 105 °C | 30 µin | Gold | Beryllium Copper | 0.3 in | 0.3" (7.62mm) Row Spacing DIP | Through Hole | Closed Frame Elevated | Brass | Solder | 2 | 10 | 20 | 0.1 in | Gold | 10 µin | 0.1 in | Glass Filled Nylon 4/6 PA46 Polyamide |