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CONN IC SKT DBL
| Part | Contact Finish - Mating | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Pitch - Mating | Pitch - Mating | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Contact Material - Mating | Material Flammability Rating | Contact Finish - Post | Housing Material | Contact Resistance | Current Rating (Amps) | Mounting Type | Features | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Termination | Operating Temperature [Min] | Operating Temperature [Max] | Termination Post Length | Termination Post Length | Contact Material - Post | Type | Type | Type | Pitch - Post | Pitch - Post | Number of Positions or Pins (Grid) | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Mill-Max Manufacturing Corp. | Gold | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | 2 x 16 | 32 | Beryllium Copper | UL94 V-0 | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 10 mOhm | 3 A | Surface Mount | Open Frame | 30 Áin | 0.76 Ám | Solder | -55 °C | 125 °C | 3.18 mm | 0.125 in | Brass Alloy | DIP | 0.6 in | 15.24 mm | 2.54 mm | 0.1 in | ||||||
Mill-Max Manufacturing Corp. | Gold | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Beryllium Copper | UL94 V-0 | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 10 mOhm | 3 A | Through Hole | Decoupling Capacitor Open Frame | 30 Áin | 0.76 Ám | Solder | -55 °C | 125 °C | 3.18 mm | 0.125 in | Brass Alloy | DIP | 0.3 " | 7.62 mm | 2.54 mm | 0.1 in | 20 | |||||||
Mill-Max Manufacturing Corp. | Gold | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | 2 x 5 | Beryllium Copper | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 3 A | Through Hole | Open Frame | 30 Áin | 0.76 Ám | Solder | -55 °C | 125 °C | 3.18 mm | 0.125 in | Brass Alloy | DIP | 0.2 in | 5.08 mm | 2.54 mm | 0.1 in | 10 | ||||||||
Mill-Max Manufacturing Corp. | Gold | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Beryllium Copper | UL94 V-0 | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 10 mOhm | 3 A | Surface Mount | Open Frame | 30 Áin | 0.76 Ám | Solder | -55 °C | 125 °C | 3.18 mm | 0.125 in | Brass Alloy | DIP | 0.9 in | 22.86 mm | 2.54 mm | 0.1 in | 25 | 2 | 50 | |||||
Mill-Max Manufacturing Corp. | Gold | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Beryllium Copper | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 3 A | Through Hole | Decoupling Capacitor Open Frame | 30 Áin | 0.76 Ám | Solder | -55 °C | 125 °C | 3.18 mm | 0.125 in | Brass Alloy | DIP | 0.6 in | 15.24 mm | 2.54 mm | 0.1 in | 24 | |||||||||
Mill-Max Manufacturing Corp. | Gold | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Beryllium Copper | UL94 V-0 | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 10 mOhm | 3 A | Through Hole | 30 Áin | 0.76 Ám | Solder | -55 °C | 125 °C | 3.18 mm | 0.125 in | Brass Alloy | DIP | 0.6 in | 15.24 mm | 2.54 mm | 0.1 in | 40 | 2 | 20 | ||||||
Mill-Max Manufacturing Corp. | Gold | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | 2 x 16 | 32 | Beryllium Copper | UL94 V-0 | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 10 mOhm | 3 A | Through Hole | 30 Áin | 0.76 Ám | Solder | -55 °C | 125 °C | 3.18 mm | 0.125 in | Brass Alloy | DIP | 0.6 in | 15.24 mm | 2.54 mm | 0.1 in | |||||||
Mill-Max Manufacturing Corp. | Gold | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Beryllium Copper | UL94 V-0 | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 10 mOhm | 3 A | Through Hole | Open Frame | 30 Áin | 0.76 Ám | Solder | -55 °C | 125 °C | 3.18 mm | 0.125 in | Brass Alloy | DIP | 0.3 " | 7.62 mm | 2.54 mm | 0.1 in | 2 | 6 | 3 | |||||
Mill-Max Manufacturing Corp. | Gold | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Beryllium Copper | UL94 V-0 | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 10 mOhm | 3 A | Through Hole | 30 Áin | 0.76 Ám | Solder | -55 °C | 125 °C | 3.18 mm | 0.125 in | Brass Alloy | DIP | 0.4 in | 10.16 mm | 2.54 mm | 0.1 in | 22 | ||||||||
Mill-Max Manufacturing Corp. | Gold | 200 µin | 5.08 µm | 0.1 in | 2.54 mm | Beryllium Copper | Tin-Lead | Polycyclohexylenedimethylene Terephthalate (PCT) Polyester | 3 A | Through Hole | Decoupling Capacitor Open Frame | 30 Áin | 0.76 Ám | Solder | -55 °C | 125 °C | 3.18 mm | 0.125 in | Brass Alloy | DIP | 0.3 " | 7.62 mm | 2.54 mm | 0.1 in | 24 |