40-650 Series

Catalog

CONN IC DIP SOCKET 40POS GOLD

Part	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Material - Post [custom]	Contact Finish - Post	Operating Temperature [Min]	Operating Temperature [Max]	Type	Type	Type	Contact Finish - Mating	Number of Positions or Pins (Grid)	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Features	Mounting Type	Housing Material	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Termination	Contact Material - Mating	Current Rating (Amps)	Termination Post Length	Termination Post Length	Pitch - Post	Pitch - Post	Accessory Type	For Use With/Related Products	Number of Positions	Termination Post Length [x]	Termination Post Length [x]	Contact Material - Post
Aries Electronics 40-6508-211	10 çin	0.25 çm	Brass	Gold	-55 °C	125 °C	DIP	0.6 in	15.24 mm	Gold	40	20	2	0.1 in	2.54 mm	UL94 V-0	Open Frame	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	30 Áin	0.76 Ám	Wire Wrap	Beryllium Copper	3 A	0.5 in	12.7 mm	2.54 mm	0.1 in
Aries Electronics 40-650-10																													Cap (Cover)	0600 Series Header	40
Aries Electronics 40-6508-301	200 µin	5.08 µm	Brass	Tin	-55 °C	105 ░C	DIP	0.6 in	15.24 mm	Gold	40	20	2	0.1 in	2.54 mm	UL94 V-0	Open Frame	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	30 Áin	0.76 Ám	Wire Wrap	Beryllium Copper	3 A			2.54 mm	0.1 in				0.36 in	9.14 mm
Aries Electronics 40-6508-201	200 µin	5.08 µm	Brass	Tin	-55 °C	105 ░C	DIP	0.6 in	15.24 mm	Gold	40	20	2	0.1 in	2.54 mm	UL94 V-0	Open Frame	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	30 Áin	0.76 Ám	Wire Wrap	Beryllium Copper	3 A			2.54 mm	0.1 in				0.36 in	9.14 mm
Aries Electronics 40-6508-202	200 µin	5.08 µm	Brass	Tin	-55 °C	105 ░C	DIP	0.6 in	15.24 mm	Gold	40	20	2	0.1 in	2.54 mm	UL94 V-0	Open Frame	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	30 Áin	0.76 Ám	Wire Wrap	Beryllium Copper	3 A			2.54 mm	0.1 in				0.36 in	9.14 mm
Aries Electronics 40-6503-30	200 µin	5.08 µm		Tin	-55 °C	105 ░C	DIP	0.6 in	15.24 mm	Gold	40	20	2	0.1 in	2.54 mm	UL94 V-0	Closed Frame	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	Wire Wrap	Beryllium Copper	3 A	0.5 in	12.7 mm	2.54 mm	0.1 in						Phosphor Bronze
Aries Electronics 40-6508-21	10 çin	0.25 çm	Brass	Gold	-55 °C	125 °C	DIP	0.6 in	15.24 mm	Gold	40	20	2	0.1 in	2.54 mm	UL94 V-0	Open Frame	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	30 Áin	0.76 Ám	Wire Wrap	Beryllium Copper	3 A	0.5 in	12.7 mm	2.54 mm	0.1 in
Aries Electronics 40-6501-20	200 µin	5.08 µm		Tin	-55 °C	105 ░C	DIP	0.6 in	15.24 mm		40	20	2	0.1 in	2.54 mm	UL94 V-0	Closed Frame	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	200 µin	5.08 µm	Wire Wrap	Phosphor Bronze	1.5 A	0.41 in	10.41 mm	2.54 mm	0.1 in						Phosphor Bronze
Aries Electronics 40-6501-30	200 µin	5.08 µm		Tin	-55 °C	125 °C	DIP	0.6 in	15.24 mm		40	20	2	0.1 in	2.54 mm	UL94 V-0	Closed Frame	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	200 µin	5.08 µm	Wire Wrap	Phosphor Bronze	1.5 A	0.69 in	17.52 mm	2.54 mm	0.1 in						Phosphor Bronze
Aries Electronics 40-6501-31	10 çin	0.25 çm		Gold	-55 °C	125 °C	DIP	0.6 in	15.24 mm	Gold	40	20	2	0.1 in	2.54 mm	UL94 V-0	Closed Frame	Through Hole	Glass Filled Nylon 4/6 Polyamide (PA46)	10 çin	0.25 çm	Wire Wrap	Phosphor Bronze	1.5 A	0.69 in	17.52 mm	2.54 mm	0.1 in						Phosphor Bronze