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CONN IC DIP SOCKET 10POS GOLD
| Part | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Number of Positions or Pins (Grid) [custom] | Number of Positions or Pins (Grid) [custom] | Mounting Type | Contact Finish - Post | Type | Type | Type | Pitch - Post | Pitch - Post | Termination | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Material Flammability Rating | Termination Post Length | Termination Post Length | Features | Contact Material - Post [custom] | Housing Material | Contact Material - Mating | Operating Temperature [Max] | Operating Temperature [Min] | Current Rating (Amps) | Contact Finish Thickness - Post | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Aries Electronics | 30 Áin | 0.76 Ám | 2 x 5 | 10 | Through Hole | Gold | DIP | 0.6 in | 15.24 mm | 2.54 mm | 0.1 in | Solder | 0.1 in | 2.54 mm | Gold | UL94 V-0 | 3.56 mm | 0.14 in | Closed Frame Elevated | Brass | Glass Filled Nylon 4/6 Polyamide (PA46) | Beryllium Copper | 105 ░C | -55 °C | 3 A | 10 çin | 0.25 çm |