PHT-108 Series
Manufacturer: Samtec Inc.
.100" TERMINAL STRIP, PRESS-FIT
| Part | Contact Length - Mating | Insulation Material | Shrouding | Contact Shape | Contact Finish - Post | Operating Temperature (Max) | Operating Temperature (Min) | Pitch - Mating | Contact Finish - Mating | Fastening Type | Material Flammability Rating | Contact Length - Post | Number of Positions | Connector Type | Overall Contact Length | Termination | Current Rating (Per Contact) | Number of Rows | Contact Material | Style | Insulation Height | Contact Type | Row Spacing - Mating | Insulation Color | Number of Positions Loaded | Contact Finish Thickness - Mating | Mounting Type | Number of Positions Loaded |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 0.23 in | Liquid Crystal Polymer (LCP) | Unshrouded | Square | Tin | 125 °C | -55 °C | 0.1 in | Gold | Push-Pull | UL94 V-0 | 0.122 in | 16 | Header | 0.552 in | Press-Fit Solder | 4.8 A | 2 | Phosphor Bronze | Board | 0.2 in | Male Pin | 0.1 in | Black | All | 10 µin | Through Hole | |
Samtec Inc. | 0.23 in | Liquid Crystal Polymer (LCP) | Unshrouded | Square | Tin | 125 °C | -55 °C | 0.1 in | Gold | Push-Pull | UL94 V-0 | 0.122 in | 8 | Header | 0.652 in | Press-Fit Solder | 4.8 A | 1 | Phosphor Bronze | Board | 0.3 in | Male Pin | Black | All | 10 µin | Through Hole | ||
Samtec Inc. | 0.23 in | Liquid Crystal Polymer (LCP) | Unshrouded | Square | Tin | 125 °C | -55 °C | 0.1 in | Gold | Push-Pull | UL94 V-0 | 0.122 in | 16 | Header | 0.752 in | Press-Fit Solder | 4.8 A | 2 | Phosphor Bronze | Board | 0.4 in | Male Pin | 0.1 in | Black | All | 10 µin | Through Hole | |
Samtec Inc. | 0.23 in | Liquid Crystal Polymer (LCP) | Unshrouded | Square | Tin | 125 °C | -55 °C | 0.1 in | Gold | Push-Pull | UL94 V-0 | 0.122 in | 16 | Header | 0.452 in | Press-Fit Solder | 4.8 A | 2 | Phosphor Bronze | Board | 0.1 in | Male Pin | 0.1 in | Black | All | 10 µin | Through Hole | |
Samtec Inc. | 0.23 in | Liquid Crystal Polymer (LCP) | Unshrouded | Square | Tin | 125 °C | -55 °C | 0.1 in | Gold | Push-Pull | UL94 V-0 | 0.122 in | 16 | Header | 0.652 in | Press-Fit Solder | 4.8 A | 2 | Phosphor Bronze | Board | 0.3 in | Male Pin | 0.1 in | Black | All | 10 µin | Through Hole | |
Samtec Inc. | 0.23 in | Liquid Crystal Polymer (LCP) | Unshrouded | Square | Tin | 125 °C | -55 °C | 0.1 in | Gold | Push-Pull | UL94 V-0 | 0.122 in | 8 | Header | 0.452 in | Press-Fit Solder | 4.8 A | 1 | Phosphor Bronze | Board | 0.1 in | Male Pin | Black | 30 µin | Through Hole | 7 | ||
Samtec Inc. | 0.23 in | Liquid Crystal Polymer (LCP) | Unshrouded | Square | Tin | 125 °C | -55 °C | 0.1 in | Gold | Push-Pull | UL94 V-0 | 0.122 in | 8 | Header | 0.452 in | Press-Fit Solder | 4.8 A | 1 | Phosphor Bronze | Board | 0.1 in | Male Pin | Black | All | 10 µin | Through Hole | ||
Samtec Inc. | 0.23 in | Liquid Crystal Polymer (LCP) | Unshrouded | Square | Tin | 125 °C | -55 °C | 0.1 in | Gold | Push-Pull | UL94 V-0 | 0.122 in | 16 | Header | 0.452 in | Press-Fit Solder | 4.8 A | 2 | Phosphor Bronze | Board | 0.1 in | Male Pin | 0.1 in | Black | All | 30 µin | Through Hole |