ESS-125 Series
Manufacturer: Samtec Inc.
Beta
⌘K
CONN SOCKET 25POS 0.1 TIN PCB
| Part | Operating Temperature (Max) | Operating Temperature (Min) | Termination | Contact Finish - Mating | Pitch - Mating | Contact Finish - Post | Style | Material Flammability Rating | Connector Type | Contact Type | Insulation Height | Number of Rows | Fastening Type | Contact Length - Post | Mounting Type | Number of Positions Loaded | Number of Positions | Insulation Color | Contact Shape | Insulation Material | Contact Material | Contact Finish Thickness - Mating | Contact Finish Thickness - Post |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 Samtec Inc. | 125 °C | -55 °C | Solder | Tin | 0.1 in | Tin | Board | UL94 V-0 | Elevated Socket | Female Socket | 0.5 in | 1 | Push-Pull | 0.173 in | Through Hole | All | 25 | Black | Circular | Liquid Crystal Polymer (LCP) | Beryllium Copper | ||
Samtec Inc. | 125 °C | -55 °C | Solder | Gold | 0.1 in | Gold | Board | UL94 V-0 | Elevated Socket | Female Socket | 0.3 in | 1 | Push-Pull | 0.123 in | Through Hole | All | 25 | Black | Circular | Liquid Crystal Polymer (LCP) | Beryllium Copper | 10 µin | 10 µin |
Samtec Inc. | 125 °C | -55 °C | Solder | Gold | 0.1 in | Tin | Board | UL94 V-0 | Elevated Socket | Female Socket | 0.4 in | 1 | Push-Pull | 0.123 in | Through Hole | All | 25 | Black | Circular | Liquid Crystal Polymer (LCP) | Beryllium Copper | 10 µin | |
 Samtec Inc. | 125 °C | -55 °C | Solder | Gold | 0.1 in | Tin | Board | UL94 V-0 | Elevated Socket | Female Socket | 0.5 in | 1 | Push-Pull | 0.173 in | Through Hole | All | 25 | Black | Circular | Liquid Crystal Polymer (LCP) | Beryllium Copper | 10 µin | |
Samtec Inc. | 125 °C | -55 °C | Solder | Gold | 0.1 in | Tin | Board | UL94 V-0 | Elevated Socket | Female Socket | 0.4 in | 1 | Push-Pull | 0.123 in | Through Hole | All | 25 | Black | Circular | Liquid Crystal Polymer (LCP) | Beryllium Copper | 10 µin | |
Samtec Inc. | 125 °C | -55 °C | Solder | Tin | 0.1 in | Tin | Board | UL94 V-0 | Elevated Socket | Female Socket | 0.5 in | 1 | Push-Pull | 0.173 in | Through Hole | All | 25 | Black | Circular | Liquid Crystal Polymer (LCP) | Beryllium Copper | ||
Samtec Inc. | 125 °C | -55 °C | Solder | Gold | 0.1 in | Gold | Board | UL94 V-0 | Elevated Socket | Female Socket | 0.5 in | 1 | Push-Pull | 0.173 in | Through Hole | All | 25 | Black | Circular | Liquid Crystal Polymer (LCP) | Beryllium Copper | 10 µin | 10 µin |
Samtec Inc. | 125 °C | -55 °C | Solder | Tin | 0.1 in | Tin | Board | UL94 V-0 | Elevated Socket | Female Socket | 0.3 in | 1 | Push-Pull | 0.123 in | Through Hole | All | 25 | Black | Circular | Liquid Crystal Polymer (LCP) | Beryllium Copper | ||
 Samtec Inc. | 125 °C | -55 °C | Solder | Gold | 0.1 in | Gold | Board | UL94 V-0 | Elevated Socket | Female Socket | 0.4 in | 1 | Push-Pull | 0.123 in | Through Hole | All | 25 | Black | Circular | Liquid Crystal Polymer (LCP) | Beryllium Copper | 10 µin | 10 µin |
Samtec Inc. | 125 °C | -55 °C | Solder | Gold | 0.1 in | Gold | Board | UL94 V-0 | Elevated Socket | Female Socket | 0.5 in | 1 | Push-Pull | 0.173 in | Through Hole | All | 25 | Black | Circular | Liquid Crystal Polymer (LCP) | Beryllium Copper | 10 µin | 10 µin |