ESQT-127 Series

Catalog

CONN SOCKET 27POS 0.079 GOLD PCB

Part	Current Rating (Per Contact)	Material Flammability Rating	Number of Positions Loaded	Contact Type	Insulation Height	Pitch - Mating	Connector Type	Number of Rows	Contact Finish Thickness - Mating	Contact Finish - Mating	Style	Contact Finish - Post	Termination	Contact Length - Post	Insulation Color	Mounting Type	Operating Temperature (Max)	Operating Temperature (Min)	Number of Positions	Fastening Type	Contact Material	Contact Finish Thickness - Post	Contact Shape	Insulation Material	Row Spacing - Mating
Samtec Inc. ESQT-127-03-G-S-350	4.5 A	UL94 V-0	All	Forked	0.35 in	0.079 in	Elevated Socket	1	20 Ąin	Gold	Board Board or Cable	Gold	Solder	0.108 in	Black	Through Hole	125 °C	-55 °C	27	Push-Pull	Phosphor Bronze	3 µin	Square	Liquid Crystal Polymer (LCP)
Samtec Inc. ESQT-127-02-G-D-600	4.5 A	UL94 V-0	All	Forked	0.6 in	0.079 in	Elevated Socket	2	20 Ąin	Gold	Board Board or Cable	Gold	Solder	0.25 in	Black	Through Hole	125 °C	-55 °C	54	Push-Pull	Phosphor Bronze	3 µin	Square	Liquid Crystal Polymer (LCP)	0.079 in
Samtec Inc. ESQT-127-02-F-D-740	4.5 A	UL94 V-0	All	Forked	0.74 in	0.079 in	Elevated Socket	2	3 µin	Gold	Board Board or Cable	Tin	Solder	0.11 in	Black	Through Hole	125 °C	-55 °C	54	Push-Pull	Phosphor Bronze		Square	Liquid Crystal Polymer (LCP)	0.079 in
Samtec Inc. ESQT-127-02-M-D-600	4.5 A	UL94 V-0	All	Forked	0.6 in	0.079 in	Elevated Socket	2	20 Ąin	Gold	Board Board or Cable	Tin	Solder	0.25 in	Black	Through Hole	125 °C	-55 °C	54	Push-Pull	Phosphor Bronze		Square	Liquid Crystal Polymer (LCP)	0.079 in
Samtec Inc. ESQT-127-02-L-D-485	4.5 A	UL94 V-0	All	Forked	0.485 in	0.079 in	Elevated Socket	2	10 µin	Gold	Board Board or Cable	Tin	Solder	0.365 in	Black	Through Hole	125 °C	-55 °C	54	Push-Pull	Phosphor Bronze		Square	Liquid Crystal Polymer (LCP)	0.079 in
Samtec Inc. ESQT-127-02-G-D-400	4.5 A	UL94 V-0	All	Forked	0.4 in	0.079 in	Elevated Socket	2	20 Ąin	Gold	Board Board or Cable	Gold	Solder	0.45 in	Black	Through Hole	125 °C	-55 °C	54	Push-Pull	Phosphor Bronze	3 µin	Square	Liquid Crystal Polymer (LCP)	0.079 in
Samtec Inc. ESQT-127-02-G-Q-320	4.5 A	UL94 V-0	All	Forked	0.32 in	0.079 in	Elevated Socket	4	20 Ąin	Gold	Board Board or Cable	Gold	Solder	0.53 in	Black	Through Hole	125 °C	-55 °C	108	Push-Pull	Phosphor Bronze	3 µin	Square	Liquid Crystal Polymer (LCP)	0.079 in
Samtec Inc. ESQT-127-02-G-D-800	4.5 A	UL94 V-0	All	Forked	0.8 in	0.079 in	Elevated Socket	2	20 Ąin	Gold	Board Board or Cable	Gold	Solder	0.05 in	Black	Through Hole	125 °C	-55 °C	54	Push-Pull	Phosphor Bronze	3 µin	Square	Liquid Crystal Polymer (LCP)	0.079 in
Samtec Inc. ESQT-127-02-L-D-520	4.5 A	UL94 V-0	All	Forked	0.52 in	0.079 in	Elevated Socket	2	10 µin	Gold	Board Board or Cable	Tin	Solder	0.33 in	Black	Through Hole	125 °C	-55 °C	54	Push-Pull	Phosphor Bronze		Square	Liquid Crystal Polymer (LCP)	0.079 in
Samtec Inc. ESQT-127-02-G-Q-316	4.5 A	UL94 V-0	All	Forked	0.316 in	0.079 in	Elevated Socket	4	20 Ąin	Gold	Board Board or Cable	Gold	Solder	0.534 in	Black	Through Hole	125 °C	-55 °C	108	Push-Pull	Phosphor Bronze	3 µin	Square	Liquid Crystal Polymer (LCP)	0.079 in