ESQT-127 Series

Catalog

CONN SOCKET 27POS 0.079 GOLD PCB

Part	Termination	Current Rating (Amps)	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Style	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Connector Type	Contact Shape	Contact Finish - Post	Material Flammability Rating	Number of Positions Loaded	Number of Rows	Mounting Type	Insulation Color	Contact Material	Insulation Height [custom]	Insulation Height [custom]	Number of Positions	Contact Length - Post	Contact Length - Post	Contact Finish - Mating	Fastening Type	Pitch - Mating [x]	Pitch - Mating [x]	Insulation Material	Operating Temperature [Min]	Operating Temperature [Max]	Contact Type	Row Spacing - Mating	Row Spacing - Mating	Insulation Height	Insulation Height	Contact Length - Post [x]
Samtec Inc. ESQT-127-03-G-S-350	Solder	4.5 A	0.51 µm	20 µin	Board to Board Cable	3 µin	0.076 µm	Elevated Socket	Square	Gold	UL94 V-0	All	1	Through Hole	Black	Phosphor Bronze	0.35 in	8.89 mm	27	0.108 in	2.75 mm	Gold	Push-Pull	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Forked
Samtec Inc. ESQT-127-02-G-D-600	Solder	4.5 A	0.51 µm	20 µin	Board to Board Cable	3 µin	0.076 µm	Elevated Socket	Square	Gold	UL94 V-0	All	2	Through Hole	Black	Phosphor Bronze			54	0.25 in	6.35 mm	Gold	Push-Pull	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Forked	0.079 in	2 mm	0.6 in	15.24 mm
Samtec Inc. ESQT-127-02-F-D-740	Solder	4.5 A	0.076 µm	3 µin	Board to Board Cable			Elevated Socket	Square	Tin	UL94 V-0	All	2	Through Hole	Black	Phosphor Bronze			54		2.79 mm	Gold	Push-Pull	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Forked	0.079 in	2 mm	0.74 in	18.8 mm	0.11 in
Samtec Inc. ESQT-127-02-M-D-600	Solder	4.5 A	0.51 µm	20 µin	Board to Board Cable			Elevated Socket	Square	Tin	UL94 V-0	All	2	Through Hole	Black	Phosphor Bronze			54	0.25 in	6.35 mm	Gold	Push-Pull	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Forked	0.079 in	2 mm	0.6 in	15.24 mm
Samtec Inc. ESQT-127-02-G-D-400	Solder	4.5 A	0.51 µm	20 µin	Board to Board Cable	3 µin	0.076 µm	Elevated Socket	Square	Gold	UL94 V-0	All	2	Through Hole	Black	Phosphor Bronze			54	0.45 "	11.43 mm	Gold	Push-Pull	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Forked	0.079 in	2 mm	0.4 in	10.16 mm
Samtec Inc. ESQT-127-02-G-Q-320	Solder	4.5 A	0.51 µm	20 µin	Board to Board Cable	3 µin	0.076 µm	Elevated Socket	Square	Gold	UL94 V-0	All		Through Hole	Black	Phosphor Bronze			108	0.53 "	13.46 mm	Gold	Push-Pull	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Forked	0.079 in	2 mm	0.32 in	8.13 mm
Samtec Inc. ESQT-127-02-H-D-665	Solder	4.5 A	0.76 Ám	30 Áin	Board to Board Cable	3 µin	0.076 µm	Elevated Socket	Square	Gold	UL94 V-0	All	2	Through Hole	Black	Phosphor Bronze			54	0.185 in	4.7 mm	Gold	Push-Pull	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Forked	0.079 in	2 mm	0.665 in	16.9 mm
Samtec Inc. ESQT-127-02-L-D-520	Solder	4.5 A	0.25 çm	10 çin	Board to Board Cable			Elevated Socket	Square	Tin	UL94 V-0	All	2	Through Hole	Black	Phosphor Bronze			54	0.33 in	8.38 mm	Gold	Push-Pull	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Forked	0.079 in	2 mm
Samtec Inc. ESQT-127-02-G-Q-316	Solder	4.5 A	0.51 µm	20 µin	Board to Board Cable	3 µin	0.076 µm	Elevated Socket	Square	Gold	UL94 V-0	All		Through Hole	Black	Phosphor Bronze			108			Gold	Push-Pull	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Forked	0.079 in	2 mm	0.316 in	8.03 mm
Samtec Inc. ESQT-127-02-G-D-665	Solder	4.5 A	0.51 µm	20 µin	Board to Board Cable	3 µin	0.076 µm	Elevated Socket	Square	Gold	UL94 V-0	All	2	Through Hole	Black	Phosphor Bronze			54	0.185 in	4.7 mm	Gold	Push-Pull	0.079 in	2 mm	Liquid Crystal Polymer (LCP)	-55 °C	125 °C	Forked	0.079 in	2 mm	0.665 in	16.9 mm