CONN HEADER SMD 70POS 1.27MM
| Part | Number of Positions | Fastening Type | Material Flammability Rating | Contact Finish - Post | Contact Finish Thickness - Mating | Contact Finish Thickness - Mating | Contact Material | Operating Temperature [Min] | Operating Temperature [Max] | Shrouding | Row Spacing - Mating [x] | Row Spacing - Mating [x] | Contact Shape | Insulation Color | Current Rating (Amps) | Connector Type | Pitch - Mating | Pitch - Mating | Contact Finish - Mating | Termination | Mounting Type | Insulation Material | Number of Rows | Contact Length - Mating | Contact Length - Mating | Insulation Height | Insulation Height | Number of Positions Loaded | Contact Type | Contact Finish Thickness - Post | Contact Finish Thickness - Post | Features | Contact Length - Mating [x] | Contact Length - Mating |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
Samtec Inc. | 70 | Push-Pull | UL94 V-0 | Tin | 30 Áin | 0.76 Ám | Phosphor Bronze | -55 °C | 125 °C | Unshrouded | 2.54 mm | 0.1 in | Square | Black | 3.1 A | Header | 0.05 in | 1.27 mm | Gold | Solder | Surface Mount | Liquid Crystal Polymer (LCP) | 2 | 0.1 in | 2.54 mm | 0.1 in | 2.54 mm | All | Male Pin | |||||
Samtec Inc. | 70 | Push-Pull | UL94 V-0 | Gold | 10 çin | 0.25 çm | Phosphor Bronze | -55 °C | 125 °C | Unshrouded | 2.54 mm | 0.1 in | Square | Black | 3.1 A | Header | 0.05 in | 1.27 mm | Gold | Solder | Surface Mount | Liquid Crystal Polymer (LCP) | 2 | 0.1 in | 2.54 mm | 0.1 in | 2.54 mm | All | Male Pin | 3 µin | 0.076 µm | |||
Samtec Inc. | 70 | Push-Pull | UL94 V-0 | Gold | 10 çin | 0.25 çm | Phosphor Bronze | -55 °C | 125 °C | Unshrouded | 2.54 mm | 0.1 in | Square | Black | 3.1 A | Header | 0.05 in | 1.27 mm | Gold | Solder | Surface Mount | Liquid Crystal Polymer (LCP) | 2 | 0.205 in | 5.21 mm | 0.1 in | 2.54 mm | All | Male Pin | 3 µin | 0.076 µm | |||
Samtec Inc. | 70 | Push-Pull | UL94 V-0 | Tin | Phosphor Bronze | -55 °C | 125 °C | Unshrouded | 2.54 mm | 0.1 in | Square | Black | 3.1 A | Header | 0.05 in | 1.27 mm | Solder | Surface Mount | Liquid Crystal Polymer (LCP) | 2 | 5.84 mm | 0.1 in | 2.54 mm | All | Male Pin | Board Guide | 0.23 in | |||||||
Samtec Inc. | 70 | Push-Pull | UL94 V-0 | Tin | 30 Áin | 0.76 Ám | Phosphor Bronze | -55 °C | 125 °C | Unshrouded | 2.54 mm | 0.1 in | Square | Black | 3.1 A | Header | 0.05 in | 1.27 mm | Gold | Solder | Surface Mount | Liquid Crystal Polymer (LCP) | 2 | 0.1 in | 2.54 mm | 0.1 in | 2.54 mm | All | Male Pin | Board Guide | ||||
Samtec Inc. | 70 | Push-Pull | UL94 V-0 | Tin | 30 Áin | 0.76 Ám | Phosphor Bronze | -55 °C | 125 °C | Unshrouded | 2.54 mm | 0.1 in | Square | Black | 3.1 A | Header | 0.05 in | 1.27 mm | Gold | Solder | Surface Mount | Liquid Crystal Polymer (LCP) | 2 | 0.43 in | 0.1 in | 2.54 mm | All | Male Pin | Board Guide | 10.92 mm | ||||
Samtec Inc. | 70 | Push-Pull | UL94 V-0 | Gold | 10 çin | 0.25 çm | Phosphor Bronze | -55 °C | 125 °C | Unshrouded | 2.54 mm | 0.1 in | Square | Black | 3.1 A | Header | 0.05 in | 1.27 mm | Gold | Solder | Surface Mount | Liquid Crystal Polymer (LCP) | 2 | 0.43 in | 0.1 in | 2.54 mm | All | Male Pin | 3 µin | 0.076 µm | 10.92 mm | |||
Samtec Inc. | 70 | Push-Pull | UL94 V-0 | Tin | 30 Áin | 0.76 Ám | Phosphor Bronze | -55 °C | 125 °C | Unshrouded | 2.54 mm | 0.1 in | Square | Black | 3.1 A | Header | 0.05 in | 1.27 mm | Gold | Solder | Surface Mount | Liquid Crystal Polymer (LCP) | 2 | 0.43 in | 0.1 in | 2.54 mm | All | Male Pin | 10.92 mm |