32-3571 Series

Catalog

CONN IC DIP SOCKET ZIF 32POS GLD

Part	Contact Finish - Mating	Number of Positions or Pins (Grid) [custom]	Number of Positions or Pins (Grid) [custom]	Pitch - Mating	Pitch - Mating	Material Flammability Rating	Termination Post Length	Termination Post Length	Type	Type	Type	Contact Finish Thickness - Mating	Contact Finish Thickness - Mating	Mounting Type	Contact Material - Mating	Pitch - Post	Pitch - Post	Termination	Current Rating (Amps)	Housing Material	Contact Finish Thickness - Post	Contact Finish Thickness - Post	Contact Finish - Post	Features	Contact Material - Post
Aries Electronics 32-3571-11	Gold	2 x 16	32	0.1 in	2.54 mm	UL94 V-0	0.11 in	2.78 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	10 çin	0.25 çm	Through Hole	Beryllium Copper	2.54 mm	0.1 in	Solder	1 A	Polyphenylene Sulfide (PPS) Glass Filled	10 çin	0.25 çm	Gold	Closed Frame	Beryllium Copper
Aries Electronics 32-3571-10		2 x 16	32	0.1 in	2.54 mm	UL94 V-0	0.11 in	2.78 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	200 µin	5.08 µm	Through Hole	Beryllium Copper	2.54 mm	0.1 in	Solder	1 A	Polyphenylene Sulfide (PPS) Glass Filled	200 µin	5.08 µm	Tin	Closed Frame	Beryllium Copper
Aries Electronics 32-3571-16	Nickel Boron	2 x 16	32	0.1 in	2.54 mm	UL94 V-0	0.11 in	2.78 mm	7.62 mm	0.3 in	DIP ZIF (ZIP)	50 µin	1.27 µm	Through Hole	Beryllium Nickel	2.54 mm	0.1 in	Solder	1 A	Polyphenylene Sulfide (PPS) Glass Filled	50 µin	1.27 µm	Nickel Boron	Closed Frame	Beryllium Nickel