IC MCU 28SOIC
| Part | Supplier Device Package | Package / Case | Package / Case [x] | Package / Case [y] | Mounting Type | Program Memory Size | Oscillator Type | Voltage - Supply (Vcc/Vdd) [Max] | Voltage - Supply (Vcc/Vdd) [Min] | Speed | Core Processor | RAM Size | Number of I/O | Program Memory Type | EEPROM Size | Core Size | Connectivity | Data Converters | Peripherals | Operating Temperature [Max] | Operating Temperature [Min] | Package / Case | Package / Case |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
NXP USA Inc. XC68HC58EGAR2 | 28-SOIC | 28-SOIC | 0.295 in | 7.5 mm | Surface Mount | ||||||||||||||||||
NXP USA Inc. XC68HC58EIAR | 28-PLCC (11.51x11.51) | 28-LCC (J-Lead) | Surface Mount | ||||||||||||||||||||
NXP USA Inc. XC68HC705B32CFN | 52-LCC (J-Lead) | Surface Mount | 32 KB | Internal | 5.5 V | 4.5 V | 2.1 MHz | HC05 | 528 | 32 | OTP | 256 x 8 | 8-Bit | SCI | A/D 8x8b, D/A 2x8b | POR, WDT | 85 °C | -40 °C | |||||
NXP USA Inc. XC68HC705B32CB | 56-SDIP | Through Hole | 32 KB | Internal | 5.5 V | 4.5 V | 2.1 MHz | HC05 | 528 | 32 | OTP | 256 x 8 | 8-Bit | SCI | A/D 8x8b, D/A 2x8b | POR, WDT | 85 °C | -40 °C | 0.6 in | 15.24 mm | |||
NXP USA Inc. XC68HC58EIA | 28-PLCC (11.51x11.51) | 28-LCC (J-Lead) | Surface Mount |